17785522. WIRING SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
Contents
WIRING SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY APPARATUS
Organization Name
BOE Technology Group Co., Ltd.
Inventor(s)
Jianying Zhang of Beijing (CN)
WIRING SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17785522 titled 'WIRING SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY APPARATUS
The abstract of this patent application describes a wiring substrate that includes a base substrate with control areas on one side. Each control area has drive circuit pad groups, functional element pad groups, signal lines, and first connection lines.
- Drive circuit pad groups are sequentially arranged in one direction.
- Functional element pad groups are electrically connected to corresponding drive circuit pad groups.
- Signal lines run in the same direction as the drive circuit pad groups.
- First connection lines cascade two adjacent drive circuit pad groups.
- The first connection lines do not overlap with the signal lines on the base substrate.
Potential Applications: - This technology can be used in electronic devices requiring precise control and connectivity. - It can be applied in industries such as telecommunications, automotive, and consumer electronics.
Problems Solved: - Provides a structured and efficient way to connect drive circuit pad groups with functional element pad groups. - Ensures proper signal transmission without interference from connection lines.
Benefits: - Improved signal integrity and reliability. - Simplified wiring design and assembly process. - Enhanced overall performance of electronic devices.
Commercial Applications: - This technology can be utilized in the production of smartphones, tablets, GPS devices, and other electronic gadgets. - It can also find applications in industrial automation systems and medical devices.
Questions about the Technology: 1. How does this wiring substrate improve the overall performance of electronic devices? 2. What are the key advantages of using drive circuit pad groups and functional element pad groups in this configuration?
Original Abstract Submitted
A wiring substrate includes: a base substrate; and a plurality of control areas on one side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas including: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which being electrically connected with the corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, orthographic projections of the first connection lines on the base substrate not overlapping with orthographic projections of the signal lines on the base substrate.
