17773600. ARRAY SUBSTRATE AND DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)

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ARRAY SUBSTRATE AND DISPLAY APPARATUS

Organization Name

BOE Technology Group Co., Ltd.

Inventor(s)

Da Zhou of Beijing (CN)

Jianbo Wang of Beijing (CN)

Taoran Zhang of Beijing (CN)

Li Huang of Beijing (CN)

Yang Zhou of Beijing (CN)

ARRAY SUBSTRATE AND DISPLAY APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17773600 titled 'ARRAY SUBSTRATE AND DISPLAY APPARATUS

Simplified Explanation

The patent application describes an array substrate with a planarization layer, an anode material layer, and gas-releasing vias for releasing gas during fabrication.

  • An array substrate with a planarization layer
  • An anode material layer in a peripheral area
  • Gas-releasing vias in the anode material layer
  • Vias release gas in the planarization layer
  • Different aperture sizes for vias in different regions

Potential Applications

The technology described in the patent application could be applied in the following areas:

  • Display panels
  • Touchscreen devices
  • Solar panels

Problems Solved

The innovation addresses the following issues:

  • Gas bubbles during fabrication
  • Uneven surfaces on array substrates
  • Improved manufacturing processes

Benefits

The technology offers the following benefits:

  • Enhanced display quality
  • Increased durability
  • Improved efficiency in production

Potential Commercial Applications

The technology could be commercially applied in:

  • Consumer electronics manufacturing
  • Solar panel production
  • Display panel fabrication

Possible Prior Art

One possible prior art could be the use of gas-releasing vias in other types of substrates for different applications.

Unanswered Questions

How does the size of the gas-releasing vias impact the fabrication process?

The patent application mentions different aperture sizes for vias in different regions, but it does not elaborate on the specific impact of these sizes on the fabrication process.

Are there any limitations to the use of gas-releasing vias in array substrates?

While the patent application highlights the benefits of gas-releasing vias, it does not discuss any potential limitations or challenges associated with their implementation.


Original Abstract Submitted

An array substrate includes a planarization layer; an anode material layer on the planarization layer and in a peripheral area of the array substrate; and a plurality of gas releasing vias extending through the anode material layer configured to release gas in the planarization layer during a fabrication process. An aperture size of a first respective gas releasing via in a first region is smaller than an aperture size of a second respective gas releasing via in a second region.