17769270. STEREO CAMERA APPARATUS simplified abstract (HITACHI ASTEMO, LTD.)

From WikiPatents
Jump to navigation Jump to search

STEREO CAMERA APPARATUS

Organization Name

HITACHI ASTEMO, LTD.

Inventor(s)

Akihiro Yamaguchi of Tokyo (JP)

Hidenori Shinohara of Hitachinaka-shi (JP)

Kenichi Takeuchi of Hitachinaka-shi (JP)

STEREO CAMERA APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17769270 titled 'STEREO CAMERA APPARATUS

The abstract describes a stereo camera apparatus with two camera units attached to a housing, a processing device for image processing, and a circuit board for mounting the processing device. The housing and circuit board are bonded by adhesive, with the adhesive applied in a region where the length in the base line direction is shorter than the length in an orthogonal direction.

  • Simplified Explanation:

This patent application is for a stereo camera system that uses two camera units for image capture and processing, with a unique adhesive bonding method between the housing and circuit board.

  • Key Features and Innovation:

- Stereo camera apparatus with two camera units - Processing device for image processing - Circuit board for mounting the processing device - Adhesive bonding method for housing and circuit board

  • Potential Applications:

- 3D imaging - Augmented reality - Virtual reality - Robotics - Autonomous vehicles

  • Problems Solved:

- Improved image processing in stereo camera systems - Secure bonding between housing and circuit board - Enhanced durability and reliability of the camera apparatus

  • Benefits:

- High-quality image processing - Stable and secure construction - Versatile applications in various industries

  • Commercial Applications:

The stereo camera apparatus can be used in industries such as automotive, entertainment, security, and healthcare for applications like 3D modeling, object recognition, and spatial mapping.

  • Questions about Stereo Camera Apparatus:

1. How does the adhesive bonding method improve the durability of the camera system? 2. What are the potential challenges in implementing this technology in different industries?

  • Frequently Updated Research:

Stay updated on advancements in stereo camera technology, image processing algorithms, and adhesive bonding techniques for electronic devices.


Original Abstract Submitted

A stereo camera apparatus includes a housing, a first camera unit attached to the housing, a second camera unit attached to the housing, a processing device that performs image processing by using captured images acquired by capturing of the first camera unit and the second camera unit, and a circuit board on which the processing device is mounted. In the housing, a base length direction of the first camera unit and the second camera unit is a longitudinal direction, the housing and the circuit board are bonded to each other by an adhesive, and in a region in the housing, onto which the adhesive is applied, a length in the base line length direction is shorter than a length in an orthogonal direction that is a direction perpendicular to the base length direction.