17746990. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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SEMICONDUCTOR DEVICE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Yu-Hung Lin of Taichung City (TW)

Shih-Peng Tai of Hsinchu County (TW)

Kuo-Chung Yee of Taoyuan City (TW)

Chen-Hua Yu of Hsinchu City (TW)

Wei-Ming Wang of Taichung City (TW)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17746990 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a semiconductor device that includes two semiconductor dies, thermal silicon substrates, and an encapsulation. The second semiconductor die is placed on top of and connected to the first semiconductor die. The thermal silicon substrates are positioned on the first semiconductor die, but they are separated from the second semiconductor die. The encapsulation covers both the second semiconductor die and the thermal silicon substrates. It consists of a filling material layer and an insulator. The filling material layer is located between the second semiconductor die and the thermal silicon substrates, and it is separated from them by the insulator.

  • The semiconductor device includes two semiconductor dies, thermal silicon substrates, and an encapsulation.
  • The second semiconductor die is placed on top of and connected to the first semiconductor die.
  • The thermal silicon substrates are positioned on the first semiconductor die but are separated from the second semiconductor die.
  • The encapsulation covers both the second semiconductor die and the thermal silicon substrates.
  • The encapsulation consists of a filling material layer and an insulator.
  • The filling material layer is located between the second semiconductor die and the thermal silicon substrates.
  • The filling material layer is separated from the second semiconductor die and the thermal silicon substrates by the insulator.

Potential Applications

This technology could be applied in various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.

Problems Solved

The semiconductor device addresses the issue of thermal management by using thermal silicon substrates to dissipate heat effectively.

Benefits

The use of thermal silicon substrates helps in efficient heat dissipation, preventing overheating and improving the overall performance and reliability of the semiconductor device.


Original Abstract Submitted

A semiconductor device including a first semiconductor die, a second semiconductor die, thermal silicon substrates and an encapsulation is provided. The second semiconductor die is disposed on and electrically connected to the first semiconductor die. The thermal silicon substrates are disposed on the first semiconductor die, wherein the thermal silicon substrates are spaced apart from the second semiconductor die. The encapsulation is disposed on the first semiconductor die. The encapsulation encapsulates the second semiconductor die and the thermal silicon substrates. The encapsulation includes a filling material layer and an insulator, wherein the filling material layer is disposed on the first semiconductor die and located between the second semiconductor die and thermal silicon substrates, and the filling material layer is spaced apart from the second semiconductor die and the thermal silicon substrates by the insulator.

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