17740494. APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF
Organization Name
Inventor(s)
Sung Ho Jang of Hwaseong-si (KR)
Min Hwan Seo of Hwaseong-si (KR)
Jang Hwi Lee of Hwaseong-si (KR)
Young Chul Kwon of Asan-si (KR)
Akinori Okubo of Hwaseong-si (KR)
Jung Chul Lee of Hwaseong-si (KR)
APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17740494 titled 'APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF
Simplified Explanation
The patent application describes a method for dicing a substrate using a laser beam. Here are the key points:
- The method involves setting a target height for forming a first reforming region inside a target substrate.
- The target height is the distance from the upper surface of the target substrate to the first reforming region.
- A laser beam is irradiated to a sample substrate that consists of a first film and a second film in contact with the first film.
- A target condition is set based on the sample condition, which results in forming a condensing point of the laser beam on the upper surface of the first film.
- The target substrate is then irradiated with the laser beam according to the target condition to form the first reforming region inside it.
- The thickness of the second film is set as the target height.
Potential applications of this technology:
- Semiconductor manufacturing: This method can be used for dicing semiconductor substrates into smaller chips.
- Electronics manufacturing: It can be applied in the production of electronic components that require precise cutting and reforming of substrates.
- Optics industry: The method can be used for dicing and shaping optical substrates for various applications.
Problems solved by this technology:
- Precise dicing: The method allows for accurate and controlled formation of reforming regions inside the substrate, ensuring precise dicing.
- Efficient process: By using a laser beam, the dicing process can be performed quickly and with high precision, reducing the need for manual labor and increasing productivity.
- Minimized damage: The method minimizes the risk of damage to the substrate during dicing, resulting in higher yield and quality of the final products.
Benefits of this technology:
- Improved accuracy: The method enables precise control over the formation of reforming regions, leading to accurate dicing and shaping of substrates.
- Time and cost savings: By using a laser beam, the dicing process can be completed faster and with fewer resources compared to traditional methods.
- Enhanced product quality: The minimized risk of damage during dicing ensures higher yield and improved quality of the final products.
Original Abstract Submitted
A method for dicing a substrate includes setting a target height for forming a first reforming region inside a target substrate, the target height being a distance from an upper surface of the target substrate to the first reforming region; irradiating a laser beam to a first sample substrate including a first film and a second film being in contact with the first film, and setting a target condition on the basis of a sample condition that results in forming a condensing point of the laser beam on an upper surface of the first film being in contact with the second film; and irradiating the target substrate with the laser beam according to the target condition to form the first reforming region inside the target substrate, wherein a thickness of the second film is the target height.
- SAMSUNG ELECTRONICS CO., LTD.
- Sung Ho Jang of Hwaseong-si (KR)
- Min Hwan Seo of Hwaseong-si (KR)
- Jang Hwi Lee of Hwaseong-si (KR)
- Young Chul Kwon of Asan-si (KR)
- Sang Woo Bae of Seoul (KR)
- Akinori Okubo of Hwaseong-si (KR)
- Jung Chul Lee of Hwaseong-si (KR)
- Won Don Joo of Incheon (KR)
- B23K26/53
- B23K26/38
- B23K26/03