17714714. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yeohoon Yoon of Yongin-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17714714 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in this patent application includes a redistribution structure, a semiconductor chip, an encapsulant, under-bump metal (UBM) vias, UBM pads, and metal bumps.
- The redistribution structure has an insulating layer and a redistribution conductor.
- The semiconductor chip is placed on the rear surface of the redistribution structure and has a connection pad connected to the redistribution conductor.
- An encapsulant is applied on at least a portion of the semiconductor chip.
- Under-bump metal (UBM) vias extend from the redistribution conductor to the front surface of the redistribution structure within the insulating layer.
- UBM pads are located on the front surface of the redistribution structure, corresponding to the UBM vias. Each UMB pad has an exposed surface that protrudes away from the front surface of the redistribution structure.
- Metal bumps are placed on the UBM pads, making contact with the exposed surface of each UMB pad.
Potential Applications
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
- Provides a structure for efficient redistribution of electrical connections in a semiconductor package.
- Ensures reliable electrical connections between the semiconductor chip and the redistribution structure.
Benefits
- Simplifies the manufacturing process of semiconductor packages.
- Enhances the electrical performance and reliability of the package.
- Enables miniaturization and higher density of electronic devices.
Original Abstract Submitted
A semiconductor package is provided. The semiconductor package includes a redistribution structure having a front surface and a rear surface opposite the front surface, the redistribution structure including an insulating layer and a redistribution conductor provided in the insulating layer; a semiconductor chip provided on the rear surface and including a connection pad electrically connected to the redistribution conductor; an encapsulant provided on at least a portion of the semiconductor chip; under-bump metal (UBM) vias extending from the redistribution conductor to the front surface of the redistribution structure within the insulating layer; UBM pads provided on the front surface of the redistribution structure to correspond to the UBM vias, respectively, and each UMB pad of the UBM pads having an exposed surface convexly protruding away from the front surface of the redistribution structure; and a metal bump provided on the UBM pads and contacting the exposed surface of each UMB pad of the UBM pads.
