17713433. SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES
Organization Name
Inventor(s)
Yunhwan Kim of Hwaseong-si (KR)
Byeongsang Kim of Hwaseong-si (KR)
Namkyun Kim of Pyeongtaek-si (KR)
SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17713433 titled 'SUBSTRATE PROCESSING APPARATUS INCLUDING PLURALITY OF ELECTRODES
Simplified Explanation
The patent application describes a substrate processing apparatus that includes a base plate, an upper plate, a DC power supply, and a controller. The upper plate has two electrodes, a first electrode, and a second electrode, which are connected to the DC power supply through the controller. The DC power supply applies different voltages to the two electrodes.
- The substrate processing apparatus has a base plate and an upper plate with two electrodes.
- The DC power supply supplies power to the upper plate.
- The controller connects the upper plate and the DC power supply.
- The first electrode and the second electrode on the upper plate are spaced apart.
- The first controller connects the first electrode to the DC power supply.
- The second controller connects the second electrode to the DC power supply.
- The DC power supply applies a different voltage to each electrode.
Potential applications of this technology:
- Semiconductor manufacturing: The substrate processing apparatus can be used in the fabrication of semiconductor devices.
- Thin film deposition: The different voltages applied to the electrodes can control the deposition of thin films on substrates.
- Surface treatment: The apparatus can be used for surface modification or treatment of various materials.
Problems solved by this technology:
- Precise control: The ability to apply different voltages to the electrodes allows for precise control over the substrate processing.
- Uniformity: The apparatus ensures uniform processing across the substrate surface.
- Efficiency: The use of separate controllers for each electrode improves the efficiency of the processing.
Benefits of this technology:
- Improved performance: The precise control over the substrate processing leads to improved performance of the processed materials.
- Enhanced productivity: The uniform processing and efficient control contribute to increased productivity.
- Versatility: The apparatus can be used for various substrate processing applications in different industries.
Original Abstract Submitted
A substrate processing apparatus includes a base plate, an upper plate on the base plate, a DC power supply configured to supply power to the upper plate, and a controller interconnecting the upper plate and the DC power supply. The upper plate includes a first electrode, and a second electrode spaced apart from the first electrode. The controller includes a first controller interconnecting the first electrode and the DC power supply, and a second controller interconnecting the second electrode and the DC power supply. The DC power supply is configured to apply a first voltage to the first electrode via the first controller, and configured to apply a second voltage to the second electrode via the second controller. The first voltage and the second voltage are different.