17699525. CHIP-ON-FILM PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
CHIP-ON-FILM PACKAGE
Organization Name
Inventor(s)
Jeong-Kyu Ha of Hwaseong-si (KR)
CHIP-ON-FILM PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17699525 titled 'CHIP-ON-FILM PACKAGE
Simplified Explanation
The abstract describes a chip-on-film package design for semiconductor chips. Here is a simplified explanation of the abstract:
- The chip-on-film package includes a film substrate that has a chip region and an edge region.
- A semiconductor chip is mounted on the top surface of the film substrate, specifically on the chip region.
- The semiconductor chip has a chip pad adjacent to its bottom surface.
- An input line and an output line are provided on the edge region of the film substrate, both located on the top surface.
- A connection terminal is placed between the film substrate and the semiconductor chip.
- A redistribution pattern is positioned between the semiconductor chip and the connection terminal.
Potential applications of this technology:
- Semiconductor packaging industry
- Electronics manufacturing
Problems solved by this technology:
- Provides a compact and efficient packaging solution for semiconductor chips
- Enables better connectivity and signal transmission between the chip and external components
Benefits of this technology:
- Reduces the size and weight of the package
- Improves electrical performance and signal integrity
- Enhances overall reliability and durability of the chip package
Original Abstract Submitted
A chip-on-film package may include a film substrate including a chip region and an edge region, a semiconductor chip provided on the chip region and mounted on a top surface of the film substrate, the semiconductor chip including a chip pad adjacent to a bottom surface thereof, an input line and an output line provided on the edge region and disposed on the top surface of the film substrate, a connection terminal interposed between the film substrate and the semiconductor chip, and a redistribution pattern disposed between the semiconductor chip and the connection terminal.
