17657202. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jong In Kang of Hwaseong-si (KR)

Jun Young Choi of Seoul (KR)

Yoon Gi Hong of Seoul (KR)

Tae Hoon Kim of Seoul (KR)

Sung-Jin Yeo of Yongin-si (KR)

Sang Yeon Han of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17657202 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a semiconductor device with a substrate that has a cell region and a core region. A boundary element separation film is placed inside the substrate to separate the cell and core regions. A bit line is placed on the cell region and the boundary element separation film, extending along a first direction. The boundary element separation film has two regions with different heights on their upper sides, based on the bottom side of the film. The bit line is placed over both regions of the boundary element separation film.

  • The semiconductor device has a substrate with a cell region and a core region.
  • A boundary element separation film is used to separate the cell and core regions.
  • The boundary element separation film has two regions with different heights on their upper sides.
  • A bit line is placed on the cell region and the boundary element separation film, extending along a first direction.
  • The bit line is placed over both regions of the boundary element separation film.

Potential Applications

  • This semiconductor device can be used in various electronic devices such as computers, smartphones, and tablets.
  • It can be applied in memory chips, processors, and other integrated circuits.

Problems Solved

  • The boundary element separation film helps in separating the cell and core regions of the substrate, preventing interference between them.
  • The different heights of the regions in the boundary element separation film provide a more efficient and compact design for the bit line placement.

Benefits

  • The semiconductor device offers improved performance and reliability by effectively separating the cell and core regions.
  • The different heights of the regions in the boundary element separation film allow for a more compact and efficient layout of the bit line.
  • This innovation can lead to smaller and more powerful electronic devices with enhanced functionality.


Original Abstract Submitted

A semiconductor device is provided. The semiconductor device includes a substrate which includes a cell region and a core region, a boundary element separation film which is placed inside the substrate, and separates the cell region and the core region, and a bit line which is placed on the cell region and the boundary element separation film and extends along a first direction, in which the boundary element separation film includes a first region and a second region, a height of an upper side of the first region of the boundary element separation film is different from a height of an upper side of the second region of the boundary element separation film, on a basis of a bottom side of the boundary element separation film, and the bit line is placed over the first region and the second region of the boundary element separation film.