17598900. DISPLAY PANEL AND MANUFACTURING METHOD THEREOF simplified abstract (SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)

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DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

Organization Name

SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

Inventor(s)

Liangfen Zhang of Shenzhen, Guangdong (CN)

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17598900 titled 'DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

Simplified Explanation:

The patent application describes a display panel and its manufacturing method, which includes layers of metal, insulating material, and a dam layer to prevent overflow of solder paste during bonding of a light-emitting unit.

  • The display panel consists of a substrate, a metal layer with signal wiring, an insulating layer, and a dam layer.
  • A light-emitting unit is bonded to the signal wiring using solder paste in specific openings in the layers.
  • The dam layer's height prevents the solder paste from overflowing during the bonding process.

Key Features and Innovation:

  • Use of a dam layer to control the flow of solder paste during bonding.
  • Specific openings in the layers for precise bonding of the light-emitting unit.
  • Prevents overflow of solder paste, ensuring a secure bond between components.

Potential Applications:

The technology can be applied in the manufacturing of various display panels, especially those requiring precise bonding of components.

Problems Solved:

  • Prevents overflow of solder paste during bonding process.
  • Ensures secure and precise bonding of components in the display panel.

Benefits:

  • Improved manufacturing process for display panels.
  • Enhanced reliability and durability of the bonded components.

Commercial Applications:

The technology can be utilized in the production of LED displays, OLED screens, and other electronic devices requiring precise component bonding.

Questions about the Technology: 1. How does the dam layer prevent the overflow of solder paste during bonding? 2. What are the advantages of using specific openings in the layers for bonding components?

Frequently Updated Research:

Stay updated on advancements in display panel manufacturing techniques and materials to enhance the efficiency and effectiveness of the technology.


Original Abstract Submitted

A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, a first metal layer, a first insulating layer, and a dam layer arranged in a stack. The first metal layer includes a first signal wiring. A light-emitting unit is bonded to the first signal wiring through a solder paste in a first opening of the first insulating layer and a second opening of the dam layer. A side of the dam layer away from the substrate is higher than or equal to a side of the solder paste away from the substrate. This application can prevent the solder paste from overflowing.

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