17591144. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyung Gyun Noh of Hwaseong-si (KR)
Jin Soo Bae of Seongnam-si (KR)
Deok-Seon Choi of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17591144 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The present disclosure describes a semiconductor package that aims to improve performance and reliability. It includes two devices that are electrically connected to each other.
- The first device consists of a substrate, a first pad on the upper side of the substrate, and a passivation film surrounding the first pad.
- The second device has a second pad facing the first pad.
- The first pad is composed of a center pad with a higher elastic modulus and an edge pad with a lower elastic modulus, which surrounds the center pad and contacts the passivation film.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics industry
- Integrated circuit design and production
Problems solved by this technology:
- Improves performance and reliability of semiconductor packages
- Enhances the electrical connection between devices
- Reduces the risk of damage or failure during operation
Benefits of this technology:
- Improved performance and reliability of semiconductor packages
- Enhanced electrical connection between devices
- Reduced risk of damage or failure during operation
Original Abstract Submitted
The present disclosure provides a semiconductor package capable of improving performance and reliability. The semiconductor package of the present disclosure includes a first device and a second device that are electrically connected to each other, the first device includes a substrate, a first pad formed on an upper side of the substrate, and a passivation film formed on the upper side of the substrate and formed to surround the first pad, the second device includes a second pad placed to face the first pad, and the first pad has a center pad having a first elastic modulus and an edge pad having a second elastic modulus smaller than the first elastic modulus, the edge pad formed to surround the center pad and to contact the passivation film.
