17535664. MULTIPLE DIE ASSEMBLY simplified abstract (International Business Machines Corporation)
Contents
MULTIPLE DIE ASSEMBLY
Organization Name
International Business Machines Corporation
Inventor(s)
Katsuyuki Sakuma of Fishkill NY (US)
Mukta Ghate Farooq of Hopewell Jct NY (US)
John Knickerbocker of Monroe NY (US)
MULTIPLE DIE ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 17535664 titled 'MULTIPLE DIE ASSEMBLY
Simplified Explanation
The abstract describes a semiconductor die package that includes a substrate with multiple layers and connections, as well as one or more dies with external connections. The package also includes metallic dam stiffeners that form an enclosure around the dies, with electrically connected and insulated regions.
- The semiconductor die package includes a substrate with multiple layers and connections.
- One or more dies are placed on the top substrate layer, with external connections.
- Metallic dam stiffeners are used to form an enclosure around the dies.
- The dam enclosure has electrically connected regions where it is connected to the substrate connections.
- The dam enclosure also has electrically insulated regions where it is insulated from the substrate connections.
Potential applications of this technology:
- Semiconductor manufacturing and assembly processes.
- Electronic devices and systems that require heat removal and underfill application.
Problems solved by this technology:
- Provides stiffness to the substrates/package during manufacturing, assembly, and operation.
- Confines the underfill application process.
- Provides a heat conduction path for efficient heat removal.
Benefits of this technology:
- Improved structural integrity of the semiconductor die package.
- Enhanced heat dissipation capabilities.
- Simplified manufacturing and assembly processes.
Original Abstract Submitted
A semiconductor die package that has a substrate with one or more substrate layers with one or more substrate connections. A substrate layer can include one or more redistribution layers (RDLs). One or more dies (e.g., multiple dies) are disposed on a top substrate layer. The dies have one or more die external connections. Some of the die external connections are electrically connected to one or more substrate connections. One or more metallic dam stiffeners form into a dam enclosure that is disposed on and physically connected to the top substrate layer. The dam enclosure encloses one or more of the dies. The metallic dam enclosure has one or more electrically connected regions where the metallic dam enclosure is electrically connected to one or more of the substrate horizontal connections and one or more electrically insulated regions where the metallic dam enclosure is electrically insulated from one or more of the substrate horizontal connections and the substrate via connections. In different embodiments, the dam enclosure stiffens the substrates/package during manufacture, assembly, and operation; provides confinement for underfill application; and provides a heat conduction path for heat removal. Methods of manufacturing and assembling the die package are disclosed.
