17532031. MODULAR LIQUID COOLING ARCHITECTURE FOR LIQUID COOLING simplified abstract (GOOGLE LLC)

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MODULAR LIQUID COOLING ARCHITECTURE FOR LIQUID COOLING

Organization Name

GOOGLE LLC

Inventor(s)

Jerry Chiu of Pacifica CA (US)

Madhusudan K. Iyengar of Foster City CA (US)

MODULAR LIQUID COOLING ARCHITECTURE FOR LIQUID COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17532031 titled 'MODULAR LIQUID COOLING ARCHITECTURE FOR LIQUID COOLING

Simplified Explanation

The patent application describes a housing and cooling system for computer hardware, consisting of an infrastructure module and a payload module. The infrastructure module is designed to house computer hardware and can be equipped with either a convective air cooling system or a liquid cooling system. The infrastructure module also includes a programmable logic controller (PLC). The payload module is located outside of the infrastructure module and includes an immersion cooling system that is controlled by the PLC.

  • The system includes an infrastructure module for housing computer hardware.
  • The infrastructure module can be equipped with a convective air cooling system or a liquid cooling system.
  • The infrastructure module also houses a programmable logic controller (PLC).
  • The system includes a payload module located outside of the infrastructure module.
  • The payload module includes an immersion cooling system that is controlled by the PLC.

Potential Applications

  • Data centers and server rooms.
  • High-performance computing facilities.
  • Cryptocurrency mining operations.
  • Industrial automation systems.

Problems Solved

  • Overheating of computer hardware.
  • Inefficient cooling methods.
  • Limited cooling options for densely packed hardware.
  • Difficulty in managing and controlling cooling systems.

Benefits

  • Efficient cooling of computer hardware.
  • Flexibility to choose between air and liquid cooling methods.
  • Improved performance and longevity of computer equipment.
  • Centralized control and management of cooling systems.


Original Abstract Submitted

A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.

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