Pages that link to "17815784. INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)"

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The following pages link to 17815784. INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated):

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QUALCOMM Incorporated patent applications published on February 1st, 2024 ‎ (← links)

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