US Patent Application 18349943. DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Jin-Yup Kim of Cheonan-si (KR)
Deukjong Kim of Cheonan-si (KR)
Hagyeong Song of Cheonan-si (KR)
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18349943 titled 'DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a display device with a light-emitting element and a touch sensor.
- The display device includes a light-emitting element that is connected to a driving element.
- An encapsulation layer covers the light-emitting element to protect it.
- A touch sensor is placed on top of the encapsulation layer for touch input.
- The device also includes a connection pad with multiple conductive layers for electrical connections.
- A cladding layer made of organic material covers the side surface of one of the conductive layers.
- A passivation layer made of inorganic material covers the cladding layer and is located under another conductive layer.
- A driving circuit is attached to the connection pad to control the display device.
Original Abstract Submitted
A display device includes: a light-emitting element at a display area; a driving element electrically connected to the light-emitting element; an encapsulation layer covering the light-emitting element; a touch sensor on the encapsulation layer; a connection pad at a bonding area, the connection pad including a lower conductive layer, an intermediate conductive layer on the lower conductive layer, and an upper conductive layer on the intermediate conductive layer; a cladding layer covering at least a side surface of the intermediate conductive layer and including an organic material; a passivation layer covering an upper surface of the cladding layer and including an inorganic material, a portion of the passivation layer being located under the upper conductive layer; and a driving circuit attached to the connection pad.