US Patent Application 18311451. ELECTRONIC COMPONENT WITH ALIGNED DIE simplified abstract
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Contents
ELECTRONIC COMPONENT WITH ALIGNED DIE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
[[Teppo Syrj�nen of Helsinki (FI)]]
ELECTRONIC COMPONENT WITH ALIGNED DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18311451 titled 'ELECTRONIC COMPONENT WITH ALIGNED DIE
Simplified Explanation
The abstract describes an electronic component with a first die, a support, and a die-aligning element.
- The component includes a first die, a support, and a die-aligning element.
- The die-aligning element has a first die-alignment wall.
- The first die is horizontally fixed to the first die-alignment wall using a die-attach material.
- The opposite side of the first die is horizontally unfixed.
Original Abstract Submitted
An electronic component is provided that includes a first die, a support with a die-attachment surface and a die-aligning element that is adjacent to the die-attachment surface. The die aligning element includes a first die-alignment wall. Moreover, a first side of the first die is horizontally fixed to the first die-alignment wall with a die-attach material. The side of the first die that is opposite to the first side of the first die is horizontally unfixed.