US Patent Application 18126017. ELECTROSTATIC CHUCK APPARATUS simplified abstract
Contents
ELECTROSTATIC CHUCK APPARATUS
Organization Name
Inventor(s)
Yoshiaki Moriya of Yokohama (KR)
ELECTROSTATIC CHUCK APPARATUS - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18126017 Titled 'ELECTROSTATIC CHUCK APPARATUS'
Simplified Explanation
The abstract describes an electrostatic chuck apparatus that is designed to reduce temperature imbalance in a heated wafer substrate. The apparatus includes a base with a cooling flow path, an adiabatic layer, a uniform heating plate, a heating element, an insulating layer with a ceramic material, a conductive layer with a smaller area than the insulating layer, and a dielectric layer with a ceramic material.
Original Abstract Submitted
An electrostatic chuck apparatus is provided that is capable of effectively reducing temperature imbalance of a wafer substrate that is heated to a high temperature. The electrostatic chuck apparatus includes a base including a cooling flow path through which a refrigerant may flow, an adiabatic layer on the base, a uniform heating plate on the adiabatic layer, a heating element between the adiabatic layer and the uniform heating plate, an insulating layer on the uniform heating plate and including a ceramic, a conductive layer on the insulating layer and having an area smaller than an area of the insulating layer, and a dielectric layer on the conductive layer and including a ceramic.
