Tokyo electron limited (20240295027). SUBSTRATE PROCESSING APPARATUS simplified abstract

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SUBSTRATE PROCESSING APPARATUS

Organization Name

tokyo electron limited

Inventor(s)

Junnosuke Taguchi of Iwate (JP)

Yasushi Takeuchi of Iwate (JP)

Manabu Honma of Iwate (JP)

Ibuki Hayashi of Iwate (JP)

SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240295027 titled 'SUBSTRATE PROCESSING APPARATUS

The patent application describes a substrate processing apparatus with a vacuum chamber, a rotary table, and a stage that rotates with the rotary table. The rotary table has an opening away from its center, with the inner surface continuous with the upper and lower surfaces, and the stage is separated from the opening by a clearance.

  • The substrate processing apparatus includes a vacuum chamber for processing substrates.
  • A rotary table is rotatably provided in the vacuum chamber.
  • A stage is configured to rotate along with the rotary table.
  • The rotary table features an opening located away from its rotation center.
  • The inner surface of the opening is connected to the upper and lower surfaces of the rotary table.
  • The stage is spaced apart from the inner surface of the opening by a clearance.

Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production

Problems Solved: - Enhanced substrate processing efficiency - Improved uniformity in coating applications

Benefits: - Increased productivity in substrate processing - Consistent and precise coating results

Commercial Applications: Title: Advanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can be utilized in semiconductor manufacturing facilities to streamline substrate processing operations, leading to higher throughput and improved product quality. The market implications include increased competitiveness and cost-effectiveness for semiconductor manufacturers.

Questions about the technology: 1. How does the substrate processing apparatus improve coating uniformity? - The apparatus ensures consistent coating results by maintaining a precise distance between the stage and the opening on the rotary table. 2. What are the potential cost savings associated with using this technology in semiconductor manufacturing? - By increasing productivity and reducing material waste, semiconductor manufacturers can achieve significant cost savings over time.


Original Abstract Submitted

a substrate processing apparatus includes a vacuum chamber; a rotary table rotatably provided in the vacuum chamber; and a stage configured to rotate together with the rotary table. the rotary table has an opening provided at a position spaced apart from a rotation center of the rotary table. an inner surface of the opening is continuous with an upper surface and a lower surface of the rotary table. the stage is spaced apart from the inner surface of the opening by a clearance.