Tokyo electron limited (20240250064). SUBSTRATE PROCESSING METHOD simplified abstract

From WikiPatents
Jump to navigation Jump to search

SUBSTRATE PROCESSING METHOD

Organization Name

tokyo electron limited

Inventor(s)

Yoshihisa Matsubara of Tokyo (JP)

Yoshihiro Tsutsumi of Tokyo (JP)

Yohei Yamashita of Kumamoto (JP)

SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240250064 titled 'SUBSTRATE PROCESSING METHOD

Simplified Explanation: The patent application describes a method for processing a substrate that involves preparing a laminated substrate, irradiating it with laser light, forming a modified layer, and then separating the substrates.

  • The method involves preparing a laminated substrate with specific layers in a particular order.
  • Laser light is then irradiated onto the substrate from one side.
  • The laser light transmitted through the substrate forms a modified layer in one of the absorption layers.
  • The substrates are separated using the modified layer as a starting point.

Key Features and Innovation:

  • Sequential processes for substrate processing.
  • Specific layer composition for the laminated substrate.
  • Laser light irradiation for modification.
  • Controlled separation of substrates.

Potential Applications:

  • Semiconductor manufacturing.
  • Electronics industry.
  • Photovoltaic technology.

Problems Solved:

  • Efficient substrate processing.
  • Controlled modification of layers.
  • Precise separation of substrates.

Benefits:

  • Improved manufacturing processes.
  • Enhanced device performance.
  • Cost-effective production.

Commercial Applications:

  • Semiconductor fabrication.
  • Solar panel production.
  • Electronics manufacturing.

Prior Art: Prior research on laser-assisted substrate processing methods in semiconductor industry.

Frequently Updated Research: Ongoing studies on laser technology applications in material processing.

Questions about Substrate Processing: 1. How does the method ensure precise separation of substrates? 2. What are the specific characteristics of the absorption layers in the laminated substrate?


Original Abstract Submitted

the substrate processing method includes processes (a) to (d). the process (a) prepares a laminated substrate including a first substrate, a first absorption layer that absorbs laser light, a second absorption layer having an absorption coefficient with respect to the laser light higher than that of the first absorption layer, a device layer, and a second substrate in this order. the process (b) irradiates the laser light with respect to the first substrate from a side opposite to the second substrate. the process (c) irradiates the laser light transmitted through the first substrate on the first absorption layer, to form a modified layer in the first absorption layer. the process (d) separates the first substrate and the second substrate from each other using the modified layer as a starting point.

Retrieved from "http://wikipatents.org/index.php?title=Tokyo_electron_limited_(20240250064)._SUBSTRATE_PROCESSING_METHOD_simplified_abstract&oldid=201945"