Tesla, inc. (20240136303). WAFER ALIGNMENT STRUCTURE simplified abstract
Contents
- 1 WAFER ALIGNMENT STRUCTURE
WAFER ALIGNMENT STRUCTURE
Organization Name
Inventor(s)
Rishabh Bhandari of San Carlos CA (US)
Aydin Nabovati of Toronto (CA)
Ron Rosenberg of San Francisco CA (US)
Vijaykumar Krithivasan of Mountain View CA (US)
Mitchell Heschke of Los Altos CA (US)
WAFER ALIGNMENT STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136303 titled 'WAFER ALIGNMENT STRUCTURE
Simplified Explanation
The patent application describes a system on a wafer (SOW) assembly with two different structures stacked on top of each other, each with a different coefficient of thermal expansion (CTE). The structures have slots and pins that allow for movement along different axes, providing flexibility and stability in thermal expansion.
- The SOW assembly includes a first structure with a specific CTE and slots at different locations, and a second structure with a different CTE stacked on top.
- The second structure has pins that fit into the slots of the first structure, allowing for movement along different axes.
- The design allows for thermal expansion while maintaining structural integrity, making it suitable for applications requiring heat dissipation.
Potential Applications
The technology could be applied in electronic devices, such as smartphones, computers, and servers, where heat dissipation is crucial for performance and longevity.
Problems Solved
The innovation solves the problem of thermal expansion mismatch between different materials in electronic devices, which can lead to structural damage and performance issues.
Benefits
The SOW assembly design provides a solution for managing thermal expansion in electronic devices, improving reliability and performance while reducing the risk of damage due to temperature changes.
Potential Commercial Applications
The technology could be valuable in the electronics industry, particularly for manufacturers looking to enhance the thermal management capabilities of their products.
Possible Prior Art
One possible prior art could be the use of thermal expansion joints in electronic devices to address similar issues related to thermal expansion and contraction.
Unanswered Questions
How does the SOW assembly compare to traditional heat dissipation methods in terms of efficiency and cost-effectiveness?
The article does not provide a direct comparison between the SOW assembly and traditional heat dissipation methods, leaving room for further analysis and evaluation of these aspects.
What are the potential challenges in implementing the SOW assembly in mass production of electronic devices?
The article does not address the potential challenges that manufacturers may face when integrating the SOW assembly into their production processes, highlighting the need for further research and development in this area.
Original Abstract Submitted
a system on a wafer (sow) assembly is disclosed. the sow assembly can include a first sow assembly structure with a first coefficient of thermal expansion (cte). the first sow assembly structure includes first to third slots at different locations. the sow assembly can include a second sow assembly structure stacked on the first sow assembly structure. the second sow assembly structure has a second cte different from the first cte. the second sow assembly structure has first to third pins extending therefrom and disposed in the first to third slots. the first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. the first sow assembly structure can be a sow and the second sow assembly structure can be a heat dissipation structure in certain applications.
