Tesla, Inc. patent applications on September 19th, 2024
Patent Applications by Tesla, Inc. on September 19th, 2024
Tesla, Inc.: 2 patent applications
Tesla, Inc. has applied for patents in the areas of H01L23/367 (1), H01L21/48 (1), H01L23/40 (1), H05K7/20 (1), H05K1/02 (1) H01L23/3675 (1), H05K7/20454 (1)
With keywords such as: electronic, module, sliding, wafer, pedestal, arranged, tim, methods, pcb, and assemblies in patent application abstracts.
Patent Applications by Tesla, Inc.
Inventor(s): Yong guo Li of Gilroy CA (US) for tesla, inc., Rishabh Bhandari of San Carlos CA (US) for tesla, inc., Aydin Nabovati of Toronto (CA) for tesla, inc., Vijaykumar Krithivasan of Mountain View CA (US) for tesla, inc., William Chang of Mountain View CA (US) for tesla, inc.
IPC Code(s): H01L23/367, H01L21/48, H01L23/40
CPC Code(s): H01L23/3675
Abstract: wafer assemblies and related methods of manufacture are disclosed. such assemblies and methods can account for different heights of electronic modules positioned on a wafer. in an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. a first thermal interface material (tim) can be disposed between the first electronic module and a first portion of the cooling system. a second tim can be disposed between the second electronic module and a second portion of the cooling system. the height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. other wafer assemblies and methods of manufacture are disclosed.
Inventor(s): Mohamed Haitham Helmy Nasr of Sunnyvale CA (US) for tesla, inc., Aydin Nabovati of Toronto (CA) for tesla, inc., Aldrich Chester L. Ong of Sacramento CA (US) for tesla, inc., Jeffrey John Miller of Sunnyvale CA (US) for tesla, inc.
IPC Code(s): H05K7/20, H05K1/02
CPC Code(s): H05K7/20454
Abstract: a cold plate with an integrated sliding pedestal and a processing system including the same are provided. in one aspect, the processing system includes a printed circuit board (pcb), a first electronic component arranged over the pcb, and a thermal interface material (tim) arranged over the first electronic component. the system includes at least one sliding pedestal arranged over the tim. the sliding pedestal is configured to be spaced a variable distance from the pcb. the system also includes a cold plate arranged over the sliding pedestal and configured to provide a coolant to the sliding pedestal and to cool a second electronic component.
