Taiwan semiconductor manufacturing company, ltd. (20240282661). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chih-Chien Pan of Taipei City (TW)
Yu-Wei Lin of New Taipei City (TW)
Li-Hui Cheng of New Taipei City (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282661 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation:
This patent application describes a semiconductor package with multiple semiconductor elements connected to a substrate. Layers of heat transfer enhancing, thermal conductive, and adhesive materials are placed on the semiconductor elements, with a lid covering them. The thermal conductive material layer has specific properties compared to the other layers.
- The semiconductor package includes a substrate and multiple semiconductor elements connected to it.
- Layers of heat transfer enhancing, thermal conductive, and adhesive materials are placed on the semiconductor elements.
- A lid covers the semiconductor elements and is joined to the layers of materials.
- The thermal conductive material layer has unique thermal conductivity and bonding strength properties.
Key Features and Innovation:
- Integration of multiple semiconductor elements on a substrate.
- Use of specific layers of materials for heat transfer and adhesion.
- Lid covering the semiconductor elements for protection and stability.
Potential Applications:
- Electronics manufacturing
- Semiconductor industry
- Thermal management systems
Problems Solved:
- Efficient heat transfer in semiconductor packages
- Enhanced stability and protection for semiconductor elements
Benefits:
- Improved thermal performance
- Increased reliability of semiconductor devices
- Enhanced overall functionality
Commercial Applications:
Potential commercial applications include the manufacturing of electronic devices, semiconductor components, and thermal management systems for various industries.
Prior Art:
Readers can explore prior art related to semiconductor packaging, thermal management systems, and materials science in the semiconductor industry.
Frequently Updated Research:
Stay updated on the latest developments in semiconductor packaging, thermal conductivity materials, and heat transfer technologies for electronic devices.
Questions about Semiconductor Package Technology:
1. What are the key components of a semiconductor package? 2. How does the thermal conductive material layer contribute to the overall performance of the package?
Original Abstract Submitted
a semiconductor package and a manufacturing method thereof are provided. the package includes a substrate, and first, second and third semiconductor elements disposed on and electrically connected to the substrate. a heat transfer enhancing layer, a thermal conductive material layer and an adhesive material layer are respectively disposed on and joined to the first, second and third semiconductor elements. a lid is disposed over the first, second and third semiconductor elements, and joined to the heat transfer enhancing layer, the thermal conductive material layer and the adhesive material layer. the thermal conductive material layer has a thermal conductivity lower than that of the heat transfer enhancing layer and higher than that of the adhesive material layer, and the thermal conductive material layer has a bonding strength larger than that of the heat transfer enhancing layer and smaller than that of the adhesive material layer.
