Taiwan semiconductor manufacturing company, ltd. (20240258122). PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND MANUFACTURING METHOD THEREOF simplified abstract

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PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chen-Hua Yu of Hsinchu City (TW)

Yian-Liang Kuo of Hsinchu City (TW)

Kuo-Chung Yee of Taoyuan City (TW)

PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240258122 titled 'PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND MANUFACTURING METHOD THEREOF

The abstract describes a package structure that includes a first thermal dissipation structure. This structure comprises a semiconductor substrate, conductive vias, a thermal transmission structure, first capacitors, bonding pads, and bonding vias. The conductive vias are embedded in the semiconductor substrate, while the thermal transmission structure is placed over the semiconductor substrate and conductive vias, featuring a conductive plane. The first capacitors are partially embedded in the thermal transmission structure, along with the bonding pads and bonding vias. The bonding vias connect the conductive vias and bonding pads, with the conductive plane making physical contact with the sidewalls of at least one bonding pad.

  • The package structure includes a first thermal dissipation structure with various components embedded within it.
  • The thermal transmission structure features a conductive plane for efficient heat dissipation.
  • The bonding vias electrically connect the conductive vias and bonding pads.
  • The conductive plane makes physical contact with the sidewalls of the bonding pads for enhanced thermal conductivity.
  • This innovative structure aims to improve thermal dissipation in semiconductor packages.

Potential Applications: - This technology can be applied in electronic devices where efficient thermal dissipation is crucial. - It can be used in high-performance computing systems, servers, and other electronics with high heat generation.

Problems Solved: - Addresses the issue of thermal management in semiconductor packages. - Improves the overall performance and reliability of electronic devices by enhancing thermal dissipation.

Benefits: - Enhanced thermal dissipation capabilities leading to improved performance and longevity of electronic devices. - Increased efficiency in heat management, reducing the risk of overheating and potential damage.

Commercial Applications: Title: Enhanced Thermal Dissipation Structure for Semiconductor Packages This technology can be utilized in the manufacturing of electronic devices such as smartphones, laptops, servers, and other high-performance computing systems. It can also find applications in the automotive industry for electronic control units and power modules.

Questions about Enhanced Thermal Dissipation Structure for Semiconductor Packages:

1. How does this technology compare to traditional thermal dissipation methods used in semiconductor packages? This technology offers improved thermal dissipation capabilities compared to traditional methods by embedding various components within the thermal transmission structure for enhanced heat management.

2. What are the potential cost implications of implementing this innovative thermal dissipation structure in electronic devices? The initial cost of implementing this technology may be higher due to the additional components and manufacturing processes involved. However, the long-term benefits of improved performance and reliability may outweigh the initial investment.


Original Abstract Submitted

a package structure includes a first thermal dissipation structure. the first thermal dissipation structure includes a semiconductor substrate, conductive vias, a thermal transmission structure, first capacitors, bonding pads, and bonding vias. the conductive vias are embedded in the semiconductor substrate. the thermal transmission structure is disposed over the semiconductor substrate and the conductive vias. the thermal transmission structure includes a conductive plane. the first capacitors are at least partially embedded in the thermal transmission structure. the bonding pads and the bonding vias are embedded in the thermal transmission structure. the bonding vias electrically connect the conductive vias and the bonding pads. the conductive plane is in physical contact with sidewalls of at least one of the bonding pads.

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