Sumitomo electric industries, ltd. (20240304514). COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL simplified abstract
Contents
COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL
Organization Name
sumitomo electric industries, ltd.
Inventor(s)
Shin-ichi Yamagata of Yamagata (JP)
COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240304514 titled 'COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL
The abstract describes a composite material with a plate shape, consisting of alternating layers of copper and molybdenum powder compact impregnated with copper, with compressive residual stress of 50 MPa or less on each layer.
- The composite material has a plate shape with a first surface and a second surface.
- Alternating layers of copper and molybdenum powder compact impregnated with copper are stacked along the thickness direction.
- The compressive residual stress on each layer is 50 MPa or less.
- The copper layers are located at both the first and second surfaces.
- The molybdenum powder compact layer is impregnated with copper.
Potential Applications: - Aerospace industry for lightweight structural components - Electronics industry for heat dissipation materials - Automotive industry for high-performance engine components
Problems Solved: - Provides a lightweight yet strong material for various applications - Improves heat dissipation in electronic devices - Enhances performance in high-stress environments
Benefits: - Lightweight and strong material - Improved heat dissipation properties - Enhanced performance in demanding conditions
Commercial Applications: Title: Advanced Composite Material for Aerospace and Electronics Industries This technology can be used in the aerospace and electronics industries for manufacturing lightweight yet strong components with improved heat dissipation properties, leading to enhanced performance and efficiency.
Questions about the technology: 1. How does the compressive residual stress affect the performance of the composite material? 2. What are the advantages of using molybdenum powder compact impregnated with copper in the composite material?
Original Abstract Submitted
a composite material has a plate shape and has a first surface and a second surface. the second surface is opposite to the first surface. the composite material includes a plurality of first layers and at least one second layer. the first layers and the second layer are alternately layered along a thickness direction of the composite material such that the first layers are located at the first surface and the second surface. each of the first layers is a layer including copper. the second layer is a layer of a molybdenum powder compact impregnated with copper. a compressive residual stress of 50 mpa or less acts on each of the first layer located at the first surface and the first layer located at the second surface.
