Sk hynix inc. (20240339436). STACK PACKAGES simplified abstract
Contents
STACK PACKAGES
Organization Name
Inventor(s)
Eun Hye Do of Icheon-si Gyeonggi-do (KR)
Chang Shik Jung of Icheon-si Gyeonggi-do (KR)
STACK PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339436 titled 'STACK PACKAGES
Simplified Explanation: The abstract describes a stack package with a first bond finger and a second bond finger spaced apart, where a second semiconductor die is stacked over a first semiconductor die. Connectors link the semiconductor dies to the bond fingers.
- The stack package includes a substrate with spaced bond fingers.
- A second semiconductor die is stacked over a first semiconductor die.
- Connectors link the semiconductor dies to the bond fingers.
- The connectors have the same length.
Key Features and Innovation:
- Stacked package design with spaced bond fingers.
- Efficient connection between semiconductor dies and bond fingers.
- Symmetrical connectors for uniform length.
Potential Applications:
- Semiconductor packaging industry.
- Electronics manufacturing.
- Integrated circuit assembly.
Problems Solved:
- Ensures secure and reliable connections.
- Facilitates efficient stacking of semiconductor dies.
- Enhances overall package stability.
Benefits:
- Improved connectivity.
- Enhanced package reliability.
- Streamlined manufacturing process.
Commercial Applications:
- Semiconductor packaging companies.
- Electronics manufacturers.
- Integrated circuit designers.
Questions about Stack Package Technology: 1. How does the stack package design improve semiconductor die stacking? 2. What are the key advantages of using symmetrical connectors in this technology?
Frequently Updated Research: Ongoing research in semiconductor packaging techniques and materials could further enhance the efficiency and reliability of stack packages.
Original Abstract Submitted
a stack package is provided. the stack package includes a package substrate on which a first bond finger and a second bond finger are spaced apart from each other, and a second semiconductor die stacked over a first semiconductor die. a first connector connects the first semiconductor die to the first bond finger. a second connector connects the second semiconductor die to the second bond finger and extends to have substantially the same length as the first connector.
