Samsung electronics co., ltd. (20240347437). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
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Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347437 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a redistribution substrate with multiple redistribution layers, an upper and lower redistribution layer, a first pad structure, a second pad structure connected to the upper redistribution layer, a through-via for electrical connection, and a semiconductor chip.
- The upper redistribution layer includes an upper pattern portion, a first upper pad portion connected to the first pad structure, and a second pad portion with an upper hole for the through-via.
- The lower redistribution layer includes a lower pattern portion and a lower pad portion with a lower hole for the through-via.
- The second pad structure includes a through-hole for the through-via to extend through.
Potential Applications: - This technology can be used in advanced semiconductor packaging for improved electrical connections. - It can enhance the performance and reliability of semiconductor devices in various electronic applications.
Problems Solved: - Provides a more efficient and reliable method for connecting semiconductor chips to redistribution layers. - Addresses the need for enhanced electrical connections in complex semiconductor packages.
Benefits: - Improved electrical connectivity and signal transmission. - Enhanced performance and reliability of semiconductor devices. - Enables more compact and efficient semiconductor packaging.
Commercial Applications: - This technology can be applied in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers. - It has potential use in the automotive industry for advanced driver assistance systems and vehicle electronics.
Questions about the technology: 1. How does this semiconductor package improve the electrical connections in electronic devices? 2. What are the potential market implications of implementing this technology in semiconductor packaging?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technologies to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
a semiconductor package includes a redistribution substrate including a plurality of redistribution layers in an insulating layer and including an upper redistribution and a lower redistribution layer, a first pad structure; a second pad structure on the redistribution substrate and connected to the upper redistribution layer; a through-via extending to electrically connect the second pad structure and the plurality of redistribution layers; and a semiconductor chip, wherein the upper redistribution layer includes an upper pattern portion, a first upper pad portion connected to the first pad structure, and a second pad portion having an upper hole through which the through-via extends, the lower redistribution layer includes a lower pattern portion and a lower pad portion on at least one end of the lower pattern portion and having a lower hole through which the through-via extends, and the second pad structure includes a through-hole through which the through-via extends.
