Samsung electronics co., ltd. (20240341089). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240341089 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
The semiconductor device described in the abstract includes a substrate with an active region between element isolation layers, a word line, a bit line, a buried contact, and various pads connecting these components.
- The device features element isolation layers consisting of a first and second layer, with pads positioned between them.
- The word line overlaps the active region and extends in a specific direction.
- The bit line also overlaps the active region but extends in a different direction, crossing the first direction.
- The buried contact is connected to the active region, with pads connecting it to the active region and the bit line.
- A landing pad is connected to the buried contact.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices for various electronic applications. - It can enhance the performance and efficiency of integrated circuits in electronic devices.
Problems Solved: - The device addresses the need for improved connectivity and functionality in semiconductor devices. - It provides a solution for optimizing the layout and design of integrated circuits.
Benefits: - Improved connectivity and signal transmission within semiconductor devices. - Enhanced performance and efficiency of electronic devices utilizing these semiconductor components.
Commercial Applications: - The technology can be applied in the production of smartphones, tablets, computers, and other electronic devices. - It has potential uses in the automotive industry for advanced driver assistance systems and vehicle electronics.
Questions about the Technology: 1. How does the layout of the semiconductor device contribute to its overall performance? 2. What are the specific advantages of using buried contacts in semiconductor devices?
Frequently Updated Research: - Stay updated on advancements in semiconductor manufacturing processes that could further enhance the performance of devices utilizing this technology.
Original Abstract Submitted
a semiconductor device according to some example embodiments includes: a substrate that includes an active region between element isolation layers; a word line that overlaps the active region and extends in a first direction; a bit line that overlaps the active region and extends in a second direction crossing the first direction; a buried contact connected to the active region; a first pad between and connecting the active region and the bit line; a second pad between and connecting the active region and the buried contact; and a landing pad connected to the buried contact. each of the element isolation layers includes a first element isolation layer and a second element isolation layer inside the first element isolation layer, and each of the first pad and the second pad are between the element isolation layers.
