Samsung electronics co., ltd. (20240339376). CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract
Contents
CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE
Organization Name
Inventor(s)
Seunghyun Cho of Suwon-si (KR)
CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339376 titled 'CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE
The abstract describes a chip on film package that includes a flexible base film with a chip mounting region, wirings, a semiconductor chip, a heat dissipation layer with a laser-induced carbon material, and an insulating layer.
- Flexible base film with chip mounting region
- Wirings extending in a parallel direction to the base film
- Semiconductor chip mounted on the chip mounting region and connected to the wirings
- Heat dissipation layer with laser-induced carbon material
- Insulating layer covering the heat dissipation layer
Potential Applications: - Electronics manufacturing - Semiconductor packaging industry
Problems Solved: - Efficient heat dissipation in electronic devices - Compact packaging of semiconductor chips
Benefits: - Improved thermal management - Enhanced performance and reliability of electronic devices
Commercial Applications: Title: Advanced Chip Packaging Technology for Enhanced Thermal Management This technology can be used in various electronic devices such as smartphones, tablets, and computers to improve heat dissipation and overall performance.
Questions about Chip on Film Package: 1. How does the heat dissipation layer with laser-induced carbon material improve thermal management in electronic devices? 2. What are the key advantages of using a flexible base film in chip packaging?
Original Abstract Submitted
a chip on film package includes a flexible base film having a first surface and a second surface opposite to the first surface, the base film having a chip mounting region on the first surface; a plurality of wirings extending from the chip mounting region on the first surface of the base film in a first direction parallel to an extending direction of the base film; a semiconductor chip mounted on the chip mounting region on the first surface of the base film and electrically connected to the plurality of wirings; a heat dissipation layer provided to have a predetermined thickness in a depth direction from the second surface of the base film in an area overlapping the chip mounting region, the heat dissipation layer including a laser-induced carbon material; and an insulating layer covering the heat dissipation layer on the second surface of the base film.
