Samsung electronics co., ltd. (20240337948). COMPOSITIONS FOR REMOVING PHOTORESISTS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES USING THE COMPOSITIONS simplified abstract

COMPOSITIONS FOR REMOVING PHOTORESISTS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES USING THE COMPOSITIONS

Organization Name

samsung electronics co., ltd.

Inventor(s)

HYOJIN Yun of Suwon-si (KR)

SEUNGWON Kim of Hwaseong-si (KR)

TAEYOUNG Kim of Yongin-si (KR)

WOOJUNG Park of Hwaseong-si (KR)

JINHYE Bae of Suwon-si (KR)

HYUNSEOP Shin of Yongin-si (KR)

MINTAE Lee of Yongin-si (KR)

HOON Han of Anyang-si (KR)

MOONYOUNG Kim of Seoul (KR)

MOONCHANG Kim of Yongin-si (KR)

CHEOLMO Yang of Yongin-si (KR)

YUNSEOK Choi of Yongin-si (KR)

COMPOSITIONS FOR REMOVING PHOTORESISTS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES USING THE COMPOSITIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240337948 titled 'COMPOSITIONS FOR REMOVING PHOTORESISTS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES USING THE COMPOSITIONS

The photoresist-removing composition described in the patent application consists of a polar organic solvent, an alkyl ammonium hydroxide, an aliphatic amine without a hydroxy group, and a monovalent alcohol.

• The composition is used in the manufacturing of semiconductor devices by removing photoresist patterns from substrates.
• In the production of semiconductor packages, the composition is applied to remove photoresist patterns containing via holes, allowing for the formation of conductive posts inside the holes.
• The technology enables the adhesion of semiconductor chips to substrates between the conductive posts.

Potential Applications: - Semiconductor manufacturing - Electronics industry - Microelectronics

Problems Solved: - Efficient removal of photoresist patterns - Precise formation of conductive posts - Improved adhesion of semiconductor chips

Benefits: - Enhanced semiconductor device performance - Increased production efficiency - Cost-effective manufacturing processes

Commercial Applications: The technology can be utilized in the production of various semiconductor devices, electronic components, and microelectronic systems, catering to industries such as telecommunications, automotive, and consumer electronics.

Questions about the technology: 1. How does the composition effectively remove photoresist patterns? 2. What are the specific advantages of using alkyl ammonium hydroxide in the composition?

Original Abstract Submitted

a photoresist-removing composition includes a polar organic solvent, an alkyl ammonium hydroxide, an aliphatic amine not including a hydroxy group, and a monovalent alcohol. to manufacture a semiconductor device, a photoresist pattern may be formed on a substrate, and the photoresist-removing composition may then be applied to the photoresist pattern. to manufacture a semiconductor package, a photoresist pattern including a plurality of via holes may be formed on a substrate. a plurality of conductive posts including a metal may be formed inside the plurality of via holes, and the photoresist pattern may be removed by applying a photoresist-removing composition of the inventive concept to the photoresist pattern. a semiconductor chip may be adhered to the substrate between the respective conductive posts.