Samsung electronics co., ltd. (20240332200). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Young Lyong Kim of Anyang-si (KR)
Hyunsoo Chung of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332200 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package substrate with a first vent hole, a first semiconductor chip mounted on the package substrate, an interposer with supporters on its bottom surface and a second vent hole, where the supporters make contact with the top surface of the first semiconductor chip, and the interposer is electrically connected to the package substrate through connection terminals. Additionally, the semiconductor package includes a second semiconductor chip mounted on the interposer, and a molding layer covering the first semiconductor chip, the interposer, and the second semiconductor chip.
- Package includes a package substrate with a vent hole and a semiconductor chip mounted on it.
- Interposer with supporters on the bottom surface and a vent hole, electrically connected to the package substrate.
- Second semiconductor chip mounted on the interposer.
- Molding layer covering the semiconductor chips and the interposer.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a compact and efficient way to package multiple semiconductor chips in a single package. - Ensures proper electrical connection between the chips and the package substrate. - Helps in thermal management by providing vent holes for heat dissipation.
Benefits: - Improved performance and reliability of electronic devices. - Cost-effective packaging solution for semiconductor chips. - Enhanced thermal efficiency for better heat dissipation.
Commercial Applications: Title: Semiconductor Package with Interposer for Multi-Chip Integration This technology can be commercially used in the semiconductor industry for manufacturing advanced electronic devices with multiple semiconductor chips integrated into a single package. The market implications include increased efficiency, reduced costs, and improved product quality.
Questions about Semiconductor Package with Interposer for Multi-Chip Integration:
1. How does the interposer contribute to the overall functionality of the semiconductor package? The interposer provides electrical connection between the semiconductor chips and the package substrate, as well as support for mounting multiple chips in a compact space.
2. What are the potential advantages of using a molding layer in the semiconductor package? The molding layer helps protect the semiconductor chips and the interposer from external elements, providing additional durability and reliability to the package.
Original Abstract Submitted
a semiconductor package includes a package substrate with a first vent hole, a first semiconductor chip mounted the package substrate, an interposer including supporters on a bottom surface of the interposer and a second vent hole, wherein the supporters contact a top surface of the first semiconductor chip, and the interposer is electrically connected to the package substrate through connection terminals. the semiconductor package further include a second semiconductor chip mounted on the interposer, and a molding layer disposed on the package substrate to cover the first semiconductor chip, the interposer, and the second semiconductor chip.
