Samsung electronics co., ltd. (20240324094). PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract
Contents
PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
Organization Name
Inventor(s)
OKGYEONG Park of SUWON-SI (KR)
PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240324094 titled 'PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
The abstract describes a printed circuit board with multiple layers, including a core board layer, sub-board layers, and a reinforcing board layer. It also includes equipotential plates with signal openings and a substrate interconnection structure.
- The printed circuit board consists of a base board layer with multiple stacked board layers.
- The core board layer is surrounded by sub-board layers on the upper and lower surfaces.
- A reinforcing board layer is added to enhance the structure.
- Equipotential plates are placed on interconnection layers with signal openings.
- The substrate interconnection structure connects top and bottom pads through the base board layer.
Potential Applications: - Electronics manufacturing - Telecommunications industry - Aerospace and defense technology
Problems Solved: - Improved signal transmission - Enhanced structural integrity - Increased reliability in electronic devices
Benefits: - Higher performance in electronic circuits - Better signal quality - Longer lifespan of electronic devices
Commercial Applications: Title: Advanced Printed Circuit Board Technology for Enhanced Signal Transmission This technology can be used in various industries such as telecommunications, aerospace, and electronics manufacturing to improve signal transmission and overall performance of electronic devices.
Prior Art: Researchers can explore prior patents related to printed circuit board technology, signal transmission, and substrate interconnection structures to understand the evolution of this innovation.
Frequently Updated Research: Researchers can stay informed about the latest advancements in printed circuit board technology, signal processing, and interconnection structures through industry conferences, academic journals, and technology forums.
Questions about Printed Circuit Board Technology: 1. How does this advanced circuit board technology compare to traditional circuit board designs?
- The advanced printed circuit board technology offers improved signal transmission, enhanced structural integrity, and better reliability compared to traditional designs.
2. What are the key factors to consider when implementing this technology in electronic devices?
- Factors to consider include signal quality, interconnection paths, and the overall design of the circuit board to optimize performance and reliability.
Original Abstract Submitted
a printed circuit board includes a base board layer including a plurality of board layers which are stacked, the plurality of board layers including a core board layer, a plurality of sub-board layers stacked on each of upper and lower surfaces of the core board layer, and a reinforcing board layer stacked on at least one of the plurality of sub-board layers, a plurality of equipotential plates disposed on a plurality of interconnection layers located on upper and lower surfaces of the plurality of board layers and having differential signal openings and single signal openings, and a substrate interconnection structure including a plurality of board top pads, a plurality of board bottom pads, and a plurality of board interconnection paths connecting the plurality of board top pads to the plurality of board bottom pads through the base board layer.
