Samsung electronics co., ltd. (20240321839). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kyounglim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321839 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a complex structure involving multiple layers and components.
- The package includes a first redistribution structure with a redistribution insulating layer and pattern, a first lower semiconductor device mounted on this structure, a molding layer surrounding the lower device, vertical connection conductors in the molding layer, a heat dissipation plate on the upper surface of the lower device, and multiple upper semiconductor devices on the molding layer and lower device.
- Each upper semiconductor device overlaps a different region of the lower device vertically, creating a compact and efficient design for the package.
- The vertical connection conductors provide electrical connectivity between the various components in the package, ensuring proper functionality and performance.
- The heat dissipation plate helps in dissipating heat generated by the semiconductor devices, preventing overheating and ensuring optimal operation.
- The overall design of the semiconductor package allows for a high level of integration and functionality in a compact form factor.
Potential Applications: - This technology can be used in various electronic devices requiring compact and efficient semiconductor packaging. - It can be applied in mobile devices, IoT devices, automotive electronics, and other consumer electronics products.
Problems Solved: - The technology addresses the challenge of integrating multiple semiconductor devices in a compact package while ensuring proper electrical connectivity and heat dissipation.
Benefits: - Improved integration of semiconductor devices - Enhanced electrical connectivity - Efficient heat dissipation - Compact design for space-constrained applications
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Compact Electronic Devices This technology can be utilized in the development of smartphones, tablets, smartwatches, automotive electronics, and other compact electronic devices. The compact design and efficient heat dissipation make it ideal for applications where space is limited.
Questions about the technology: 1. How does the vertical overlapping of upper semiconductor devices benefit the overall design of the package? 2. What are the key advantages of using a heat dissipation plate in this semiconductor package design?
Original Abstract Submitted
a semiconductor package includes a first redistribution structure including a first redistribution insulating layer and a first redistribution pattern, a first lower semiconductor device mounted on the first redistribution structure, a molding layer surrounding the first lower semiconductor device on the first redistribution structure, a plurality of vertical connection conductors in the molding layer and electrically connected to the first redistribution pattern, a heat dissipation plate disposed on an upper surface of the first lower semiconductor device, and a plurality of upper semiconductor devices disposed on the molding layer and on the first lower semiconductor device, each of the plurality of upper semiconductor devices vertically overlapping a different respective region of the first lower semiconductor device.
