Samsung electronics co., ltd. (20240321831). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeongmun Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321831 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first semiconductor chip, multiple second semiconductor chips stacked on top of the first chip, conductive front pads on the lower surfaces of the second chips, conductive rear pads on the upper surfaces of the first chip and each second chip, first bonding pads, second bonding pads, and chip connection terminals.
- The package features a unique design with multiple stacked semiconductor chips.
- The front and rear pads facilitate electrical connections within the package.
- The first and second bonding pads are located in different regions for specific purposes.
- Chip connection terminals ensure proper connectivity between the front and rear pads.
- The second bonding pads include supporting and fixing parts for stability.
Potential Applications: - This semiconductor package could be used in advanced electronic devices requiring compact and efficient chip stacking. - It may find applications in industries such as telecommunications, computing, and consumer electronics.
Problems Solved: - Enables efficient stacking of multiple semiconductor chips in a single package. - Facilitates reliable electrical connections between the chips.
Benefits: - Compact design saves space in electronic devices. - Improved connectivity enhances overall performance. - Potential for increased functionality in smaller form factors.
Commercial Applications: Title: Advanced Semiconductor Package for High-Performance Electronics This technology could be utilized in smartphones, tablets, laptops, and other portable electronic devices to enhance performance and reduce space requirements in compact designs.
Prior Art: Researchers can explore existing patents related to semiconductor packaging, chip stacking technologies, and electrical connection methods to understand the evolution of this innovation.
Frequently Updated Research: Researchers are constantly developing new methods to improve semiconductor packaging, chip stacking techniques, and electrical connection technologies to enhance the performance and efficiency of electronic devices.
Questions about Semiconductor Package Technology: 1. How does this semiconductor package improve the performance of electronic devices? - This technology enhances connectivity and efficiency in compact electronic devices, leading to improved overall performance. 2. What are the potential challenges in implementing this semiconductor package in commercial products? - Some challenges may include manufacturing complexity, cost considerations, and compatibility with existing device designs.
Original Abstract Submitted
provided is a semiconductor package including a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a plurality of conductive front pads on lower surfaces of the plurality of second semiconductor chips, a plurality of conductive rear pads attached to an upper surface of the first semiconductor chip and an upper surface of each of the plurality of second semiconductor chips, and including a plurality of first bonding pads and a plurality of second bonding pads in different regions, and a plurality of chip connection terminals between the plurality of conductive front pads and the plurality of conductive rear pads, wherein each of the plurality of second bonding pads includes a supporting part configured to support each of the plurality of chip connection terminals, and a fixing part protruding from an upper surface of the supporting part.
