Samsung electronics co., ltd. (20240321799). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321799 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first substrate with patterns, a semiconductor chip with a metal layer and circuit structure, and first bumps for electrical connection.
- The first substrate contains a region overlapping the circuit structure vertically, with first bumps adjacent to this region.
- The first bumps have an elongated shape parallel to the side of the region, providing efficient electrical connection.
- The first pattern on the substrate includes a ground or power pattern, enhancing the functionality of the package.
Potential Applications: This technology could be used in various semiconductor devices requiring efficient electrical connections and improved circuit structures.
Problems Solved: The semiconductor package addresses the need for reliable electrical connections and optimized circuit layouts in semiconductor devices.
Benefits: Improved electrical connectivity, enhanced circuit performance, and overall efficiency in semiconductor packaging.
Commercial Applications: This technology could have applications in the semiconductor industry for manufacturing advanced electronic devices with optimized circuit structures.
Prior Art: Researchers interested in this technology may explore prior patents related to semiconductor packaging, circuit layouts, and electrical connection methods.
Frequently Updated Research: Researchers may find updated studies on semiconductor packaging techniques, circuit design innovations, and materials for improved electrical connections.
Questions about Semiconductor Packaging: 1. How does the elongated shape of the first bumps contribute to efficient electrical connection? 2. What are the potential implications of using ground or power patterns in the first substrate for semiconductor devices?
Original Abstract Submitted
provided is a semiconductor package including a first substrate, a first pattern and a second pattern disposed on the first substrate, a semiconductor chip disposed on the first substrate and including a metal layer, a circuit structure disposed on the metal layer of the semiconductor chip, and a plurality of first bumps disposed between the first substrate and the semiconductor chip and electrically connected to the first pattern, wherein the first pattern includes a ground pattern or a power pattern, the first substrate includes a first region overlapping the circuit structure in a vertical direction, the plurality of first bumps are disposed adjacent to the first region on a top surface of the first substrate, and a first bump of the plurality of first bumps has an elongated shape substantially parallel to an adjacent side of the first region.
