Samsung electronics co., ltd. (20240321728). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Myungsam Kang of Hwaseong-si (KR)
Jeongseok Kim of Cheonan-si (KR)
Bongju Cho of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321728 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a complex structure involving multiple layers and components to enhance the performance and functionality of the semiconductor chip.
- The package consists of a first redistribution structure with insulating and redistribution layers, a semiconductor chip with connection pads embedded in the insulating layer, and a vertical connection structure.
- An encapsulant covers the semiconductor chip and vertical connection structure, providing protection and stability.
- A second redistribution structure with a redistribution layer is placed on top of the encapsulant and connected to the vertical connection structure.
- Connection bumps on the second surface are electrically connected to the first redistribution layer, enabling external connections.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers to improve their performance and reliability. - It can also be applied in automotive electronics, medical devices, and industrial equipment where high-performance semiconductor packaging is required.
Problems Solved: - The technology addresses the need for advanced semiconductor packaging solutions that can accommodate complex circuitry and provide reliable connections. - It solves the challenges of miniaturization and increasing functionality in electronic devices by offering a compact and efficient package design.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced connectivity and signal transmission capabilities. - Compact and efficient package design for space-constrained applications.
Commercial Applications: - The technology can be utilized by semiconductor manufacturers, electronics companies, and technology firms looking to enhance the performance and reliability of their products. - It has potential applications in consumer electronics, automotive electronics, medical devices, and industrial equipment markets.
Questions about Semiconductor Package Technology: 1. How does the vertical connection structure contribute to the overall performance of the semiconductor package? 2. What are the key advantages of using connection bumps on the second surface for external connections?
Original Abstract Submitted
a semiconductor package includes: a first redistribution structure having a first surface and a second surface opposing the first surface, and including a first insulating layer and a first redistribution layer disposed on the first insulating layer; a semiconductor chip disposed on the first surface of the first redistribution structure, and including a connection pad electrically connected to the first redistribution layer and embedded in the first insulating layer; a vertical connection structure disposed on the first surface and electrically connected to the first redistribution layer; an encapsulant encapsulating at least a portion of each of the semiconductor chip and the vertical connection structure; a second redistribution structure disposed on the encapsulant and including a second redistribution layer electrically connected to the vertical connection structure; and a connection bump disposed on the second surface and electrically connected to the first redistribution layer.
