Samsung electronics co., ltd. (20240321715). PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
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PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321715 titled 'PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The abstract describes a printed circuit board with multiple base layers, via pads, and through-vias that make contact with the via pads. The via pads have a unique shape with sub-shapes arranged around the center point, allowing for contact with multiple through-vias.
- The printed circuit board includes multiple base layers, via pads, and through-vias for improved connectivity.
- Each via pad has a complex shape with sub-shapes arranged around the center point for efficient contact with through-vias.
- The arrangement of via pads and through-vias enhances the overall performance and reliability of the circuit board.
- This innovation allows for more compact and efficient circuit designs, reducing space requirements and improving signal integrity.
- The unique shape of the via pads and their contact with through-vias contribute to the overall functionality and performance of the printed circuit board.
Potential Applications: - Electronics manufacturing - Telecommunications - Automotive industry
Problems Solved: - Enhanced connectivity and signal integrity - Space-saving design - Improved reliability of circuit boards
Benefits: - Increased efficiency in circuit design - Improved performance and reliability - Space-saving benefits for compact electronic devices
Commercial Applications: Title: Innovative Printed Circuit Board Technology for Enhanced Connectivity This technology can be utilized in various industries such as electronics manufacturing, telecommunications, and automotive, where compact and reliable circuit boards are essential for optimal performance.
Prior Art: Readers can explore prior research on printed circuit board design, via pad shapes, and through-via connections to understand the evolution of this technology.
Frequently Updated Research: Researchers are constantly exploring new materials and manufacturing techniques to further enhance the performance and efficiency of printed circuit boards.
Questions about Printed Circuit Board Technology: 1. How does the unique shape of the via pads contribute to improved connectivity? 2. What are the potential challenges in implementing this innovative circuit board design?
Original Abstract Submitted
a printed circuit board includes a board base including a plurality of base layers, a plurality of via pads with a via pad being disposed on each of the plurality of base layers, and a plurality of through-vias with at least one respective through-via of the plurality of through-vias penetrating a respective base layer and making contact with a respective via pad of the plurality of base layers. each via pad of the plurality of via pads has a shape in which a plurality of sub-shapes are arranged based on the center point of the respective via pad in a partially overlapping manner, and a group of through-vias are in contact with a respective via pad in a manner corresponding to the plurality of sub-shapes.
