Samsung electronics co., ltd. (20240321713). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yoonyoung Jeon of Suwon-si (KR)
Dongheon Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321713 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a complex structure involving multiple layers and components.
- The package includes a first redistribution structure, a semiconductor chip mounted on it, conductive posts, a molding layer surrounding the chip and posts, and a second redistribution structure on top.
- The second redistribution structure comprises a redistribution pattern, a pad structure connected to it, and a redistribution insulating layer.
- The pad structure consists of multiple layers, with the top layers having concavo-convex surfaces in contact with the second insulating layer.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a reliable and efficient way to package semiconductor chips. - Ensures proper insulation and connectivity within the package.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced durability and longevity of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized by semiconductor manufacturers to produce high-quality and durable electronic components for consumer and industrial applications. The market implications include increased demand for advanced packaging solutions in the electronics industry.
Questions about Semiconductor Packaging Technology: 1. How does the concavo-convex design of the pad structure benefit the overall performance of the semiconductor package? The concavo-convex design helps to improve the contact and connectivity between the pad structure and the insulating layer, enhancing the overall reliability and efficiency of the package.
2. What are the key factors that make this semiconductor packaging technology stand out in the market? The innovative design of the redistribution structures and the multi-layered pad structure sets this technology apart by offering improved performance, durability, and insulation for semiconductor chips.
Original Abstract Submitted
a semiconductor package may include a first redistribution structure, a semiconductor chip on the first redistribution structure, conductive posts spaced apart from the semiconductor chip and on the first redistribution structure, a molding layer on the first redistribution structure and surrounding the semiconductor chip and the conductive posts, and a second redistribution structure on the molding layer. the second redistribution structure may include a second redistribution pattern, a pad structure connected to the second redistribution pattern, and a second redistribution insulating layer. the second redistribution insulating layer may include a first insulating layer surrounding the second redistribution pattern and a second insulating layer surrounding at least a portion of the pad structure. the pad structure may include a second pad layer on a first pad layer. surfaces of the first and second pad layers in contact with the second insulating layer may be concavo-convex.
