Samsung electronics co., ltd. (20240321708). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
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PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321708 titled 'PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The semiconductor package described in the patent application consists of a semiconductor chip and a package substrate with various components.
- The package substrate includes a base layer, multiple upper bump pads, and an upper passivation layer with first openings.
- An insulating patch is positioned between the outer region of the semiconductor chip and the upper passivation layer, containing patch openings.
- Bump structures are located between the upper bump pads and the semiconductor chip, passing through the first openings of the passivation layer and the patch openings of the insulating patch.
Key Features and Innovation:
- Integration of insulating patch between semiconductor chip and passivation layer for improved insulation.
- Bump structures facilitate connection between upper bump pads and semiconductor chip.
Potential Applications:
- Semiconductor packaging in electronic devices.
- Microelectronics industry for improved chip performance.
Problems Solved:
- Enhanced insulation and connectivity in semiconductor packaging.
- Improved reliability and performance of semiconductor devices.
Benefits:
- Increased efficiency and reliability of semiconductor packages.
- Better signal transmission and reduced interference.
Commercial Applications:
- This technology can be utilized in the production of various electronic devices, such as smartphones, computers, and IoT devices, to enhance their performance and reliability.
Prior Art:
- Researchers and engineers can explore prior patents related to semiconductor packaging, insulation techniques, and bump structures for further insights into this technology.
Frequently Updated Research:
- Stay updated on advancements in semiconductor packaging, insulation materials, and bump structure designs to enhance the performance of electronic devices.
Questions about Semiconductor Packaging: 1. How does the insulating patch improve the performance of the semiconductor package? 2. What are the potential challenges in implementing bump structures in semiconductor packaging?
Original Abstract Submitted
a semiconductor package includes a semiconductor chip, and a package substrate including a base layer, a plurality of upper bump pads disposed on the base layer, an upper passivation layer disposed on the base layer, the upper passivation layer including a plurality of first openings, and an insulating patch disposed between an outer region of the semiconductor chip and the upper passivation layer, the insulating patch including a plurality of patch openings, and a plurality of bump structures disposed between the upper bump pads and the semiconductor chip, wherein each of the plurality of bump structures is disposed on a corresponding one of the plurality of upper bump pads through a corresponding one of the plurality of first openings of the upper passivation layer and a corresponding one of the plurality of patch openings of the insulating patch.
