Samsung electronics co., ltd. (20240321673). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
JAE CHOON Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321673 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation: This patent application describes a semiconductor package with a unique heat dissipation structure that includes different types of epoxy molding compounds with varying thermal conductivities.
Key Features and Innovation:
- Semiconductor package with redistribution layer structure
- Heat dissipation structure with first epoxy molding compound
- Molding material with second epoxy molding compound
- Higher thermal conductivity in first epoxy molding compound
Potential Applications: This technology could be used in various electronic devices that require efficient heat dissipation, such as smartphones, laptops, and other consumer electronics.
Problems Solved: This technology addresses the challenge of managing heat dissipation in semiconductor packages, which is crucial for maintaining the performance and longevity of electronic devices.
Benefits:
- Improved thermal management
- Enhanced performance and reliability of electronic devices
- Longer lifespan of semiconductor packages
Commercial Applications: The technology could be valuable for semiconductor manufacturers, electronics companies, and other industries that rely on efficient heat dissipation in their products. It could lead to the development of more reliable and high-performance electronic devices.
Questions about Semiconductor Package with Unique Heat Dissipation Structure: 1. How does the use of different epoxy molding compounds with varying thermal conductivities improve heat dissipation in semiconductor packages? 2. What are the potential implications of this technology for the consumer electronics market?
Frequently Updated Research: Researchers are constantly exploring new materials and techniques to enhance heat dissipation in semiconductor packages, so it's important to stay informed about the latest developments in this field.
Original Abstract Submitted
a semiconductor package includes a redistribution layer structure, a semiconductor structure on the redistribution layer structure, at least one heat dissipation structure on the semiconductor structure, where the at least one heat dissipation structure may include a first epoxy molding compound, a molding material for molding the semiconductor structure and the at least one heat dissipation structure, on the redistribution layer structure, where the molding material may include a second epoxy molding compound, where the first epoxy molding compound may have higher thermal conductivity than the second epoxy molding compound.
