Samsung electronics co., ltd. (20240321669). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
JAE CHOON Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321669 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a substrate, a semiconductor die mounted on the substrate, and a heat spreader that covers the semiconductor die. The heat spreader is composed of an upper plate portion, a base portion, and a sidewall portion that connects the upper plate portion to the base portion. Together, the upper plate portion and the sidewall portion create a cavity underneath. The base portion, which is situated on the substrate, extends horizontally from the sidewall portion's exterior side and features multiple first through-holes. Importantly, the base portion's bottom surface aligns with the sidewall portion's bottom surface, and its height in the vertical direction is equal to or less than that of the sidewall portion.
- The semiconductor package includes a heat spreader with an upper plate portion, a base portion, and a sidewall portion.
- The base portion of the heat spreader is situated on the substrate and extends horizontally from the sidewall portion.
- The base portion features multiple first through-holes and has a height equal to or less than that of the sidewall portion.
- The heat spreader's design helps in efficiently dissipating heat generated by the semiconductor die.
- The configuration of the heat spreader contributes to the overall thermal management of the semiconductor package.
Potential Applications: - This technology can be applied in various electronic devices where thermal management is crucial, such as computers, smartphones, and automotive electronics.
Problems Solved: - Efficient heat dissipation from the semiconductor die. - Improved thermal performance and reliability of electronic devices.
Benefits: - Enhanced thermal management capabilities. - Increased longevity and reliability of electronic components. - Improved overall performance of electronic devices.
Commercial Applications: Title: Advanced Thermal Management Solutions for Electronic Devices This technology can be utilized in the development of high-performance electronic devices, catering to industries such as consumer electronics, automotive, and telecommunications.
Questions about Semiconductor Package Technology: 1. How does the design of the heat spreader contribute to the overall thermal management of the semiconductor package? 2. What are the potential commercial applications of this technology in different industries?
Original Abstract Submitted
a semiconductor package includes a substrate, a semiconductor die on the substrate, a heat spreader covering the semiconductor die. the heat spreader includes an upper plate portion, a base portion, and a sidewall portion connecting the upper plate portion to the base portion. the upper plate portion and the sidewall portion define an underlying cavity. the base portion is disposed on the substrate, extends from an exterior side of the sidewall portion in a horizontal direction, includes a plurality of first through holes, has a bottom surface at the same level as a bottom surface of the sidewall portion, and has a height in a vertical direction from a lowermost portion to an uppermost portion thereof less than or equal to that of the sidewall portion.
