Samsung electronics co., ltd. (20240321666). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE simplified abstract
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321666 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
The method of manufacture for a semiconductor package involves forming a molding member on the side surfaces of semiconductor chips, attaching a carrier substrate to the upper surfaces of the molding member and the semiconductor chips using an adhesive, and cutting away selected portions of the carrier substrate and adhesive using a first blade.
- The first blade is used to partially cut into the upper surface of the molding member to form a first cutting groove.
- A second blade, narrower than the first blade, is used to cut through the lower surface of the molding member to form a second cutting groove.
- The combination of the first and second cutting grooves separates a package structure containing a semiconductor chip supported by a cut portion of the carrier substrate.
- The package structure is then bonded to an upper surface of a package substrate.
Potential Applications: - Semiconductor packaging industry - Electronics manufacturing
Problems Solved: - Efficient and precise cutting of carrier substrates in semiconductor packages - Secure bonding of semiconductor chips to package substrates
Benefits: - Improved manufacturing process for semiconductor packages - Enhanced structural integrity of semiconductor packages
Commercial Applications: - Semiconductor packaging companies - Electronics manufacturers
Questions about Semiconductor Package Manufacturing: 1. How does the method of using two different blade widths improve the cutting process in semiconductor packaging? 2. What are the key advantages of bonding the package structure to the package substrate in semiconductor packaging?
Original Abstract Submitted
a method of manufacture for a semiconductor package includes; forming a molding member on side surfaces of the semiconductor chips, using an adhesive to attach a carrier substrate to upper surfaces of the molding member and the semiconductor chips, using a first blade having a first blade-width to cut away selected portions of the carrier substrate and portions of the adhesive underlying the selected portions of the carrier substrate, and using the first blade to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are dispose above portions of the molding member between adjacent ones of semiconductor chips, using a second blade having a second blade-width narrower than the first blade-width to cut through a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separate a package structure including a semiconductor chip supported by a cut portion of the carrier substrate and bonding the package structure to an upper surface of a package substrate.
