Samsung electronics co., ltd. (20240320814). DEFECT REDUCTION APPARATUS AND DEFECT REDUCTION METHOD simplified abstract
Contents
- 1 DEFECT REDUCTION APPARATUS AND DEFECT REDUCTION METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DEFECT REDUCTION APPARATUS AND DEFECT REDUCTION METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Defect Inspection Technology
- 1.13 Original Abstract Submitted
DEFECT REDUCTION APPARATUS AND DEFECT REDUCTION METHOD
Organization Name
Inventor(s)
Seunghwan Yoo of Suwon-si (KR)
DEFECT REDUCTION APPARATUS AND DEFECT REDUCTION METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240320814 titled 'DEFECT REDUCTION APPARATUS AND DEFECT REDUCTION METHOD
Simplified Explanation
The patent application describes a defect inspection or reduction apparatus that includes a chamber moving a substrate, a laser oscillation structure irradiating a laser beam to the substrate, a mask processing the laser beam, a beam profiler obtaining a beam image, and a damage detector detecting defects in the mask and laser beam.
Key Features and Innovation
- Chamber for moving substrate
- Laser oscillation structure for irradiating laser beam
- Mask for processing laser beam
- Beam profiler for obtaining beam image
- Damage detector for detecting defects
Potential Applications
This technology can be used in semiconductor manufacturing, electronics production, and other industries requiring precise defect inspection and reduction processes.
Problems Solved
This technology addresses the need for accurate defect detection in masks and laser beams during manufacturing processes, ensuring high-quality output.
Benefits
- Improved quality control
- Enhanced manufacturing efficiency
- Reduction in defects and waste
Commercial Applications
Title: Advanced Defect Inspection Apparatus for Manufacturing Processes This technology can be applied in semiconductor fabrication plants, electronics manufacturing facilities, and other industries where precise defect detection is crucial for product quality.
Prior Art
Readers can explore prior art related to defect inspection systems in semiconductor manufacturing, laser processing technologies, and quality control methods in industrial settings.
Frequently Updated Research
Stay updated on the latest advancements in defect inspection technologies, laser processing techniques, and quality control methods in manufacturing industries.
Questions about Defect Inspection Technology
What are the main components of the defect inspection apparatus described in the patent application?
The main components include a chamber, laser oscillation structure, mask, beam profiler, and damage detector.
How does this technology benefit manufacturing processes in various industries?
This technology improves quality control, enhances efficiency, and reduces defects in manufacturing processes.
Original Abstract Submitted
a defect inspection or reduction apparatus includes a chamber moving a substrate and having an inner space therein, a laser oscillation structure irradiating a laser beam to a processing area of the substrate, a mask positioned in the laser oscillation structure and processing the laser beam, a beam profiler obtaining a beam image for the laser beam passing through the mask, and a damage detector detecting a defect area of the mask and the laser beam from the beam image. the damage detector includes an image pre-processing department performing a pre-processing on the beam image that is obtained from the beam profiler, an image extraction department extracting a defect area of the beam image on which the pre-processing is performed, and an image detector detecting a defect of the beam image based on the defect area.
