Samsung electronics co., ltd. (20240312974). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
KYOUNGLIM Suk of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312974 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of various components such as a lower redistribution structure, lower chip structure, posts, encapsulant, heat dissipation member, upper chip structure, and external connection bumps.
- The lower redistribution structure includes a lower redistribution layer, with a lower chip structure placed on top.
- Posts surrounding the lower chip structure have a lower metal layer and an upper metal layer.
- An encapsulant covers the lower chip structure and posts.
- A heat dissipation member overlaps the lower chip structure.
- The upper chip structure overlaps the posts and is electrically connected to the lower redistribution layer through the posts.
- External connection bumps are located below the lower redistribution structure.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides efficient heat dissipation for electronic components. - Enables reliable electrical connections between different layers. - Enhances the overall performance and longevity of semiconductor devices.
Benefits: - Improved thermal management for electronic devices. - Enhanced electrical connectivity and signal transmission. - Increased reliability and durability of semiconductor packages.
Commercial Applications: - This technology can be utilized by semiconductor manufacturers to enhance the performance and reliability of their products. - It can also benefit companies in the consumer electronics, automotive, and healthcare industries.
Questions about the technology: 1. How does the heat dissipation member contribute to the overall efficiency of the semiconductor package? 2. What are the specific advantages of using different metals in the lower and upper metal layers of the posts?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
a semiconductor package includes a lower redistribution structure including a lower redistribution layer, a lower chip structure disposed on the lower redistribution structure, a plurality of posts disposed around the lower chip structure and including a lower metal layer on the lower redistribution layer and an upper metal layer on the lower metal layer, an encapsulant covering respective side surfaces of the lower chip structure and the plurality of posts, a heat dissipation member disposed on the encapsulant and vertically overlapping at least a portion of the lower chip structure, an upper chip structure disposed on one side of the heat dissipation member and vertically overlapping at least a portion of the plurality of posts, and electrically connected to the lower redistribution layer through the plurality of posts, and external connection bumps disposed below the lower redistribution structure. the lower metal layer and the upper metal layer include different metals.
