Samsung electronics co., ltd. (20240304557). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240304557 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a complex structure involving multiple layers and components to support and protect semiconductor chips.
- The package features a unique first redistribution structure with alternating layers of redistribution and insulating materials.
- A first semiconductor chip is positioned on top of this structure, while a second semiconductor chip is surrounded by it.
- The first chip is encapsulated by a first encapsulant, while the second chip is encapsulated by a second encapsulant.
- A conductive support layer is present to support the second chip and the second encapsulant.
Potential Applications: - This technology could be used in advanced electronic devices such as smartphones, tablets, and computers. - It may also find applications in automotive electronics, industrial machinery, and medical devices.
Problems Solved: - Provides a reliable and robust packaging solution for semiconductor chips. - Offers enhanced protection against environmental factors and mechanical stress.
Benefits: - Improved reliability and durability of semiconductor devices. - Enhanced performance and longevity of electronic products.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronics This technology could revolutionize the semiconductor packaging industry by offering more reliable and durable solutions for high-performance electronic devices. It has the potential to impact various sectors, including consumer electronics, automotive, and industrial applications.
Questions about Semiconductor Packaging Technology: 1. How does the unique structure of the semiconductor package described in the patent application contribute to the overall reliability of the device? - The alternating layers of redistribution and insulating materials provide enhanced protection and support for the semiconductor chips, improving the overall reliability of the package.
2. What are the potential cost implications of implementing this advanced semiconductor packaging technology in electronic devices? - While the initial cost of implementing this technology may be higher, the long-term benefits in terms of reliability and performance may outweigh the initial investment.
Original Abstract Submitted
a semiconductor package includes a first redistribution structure in which at least one first redistribution layer and at least one first insulating layer are alternately layered; a first semiconductor chip disposed on an upper surface of the first redistribution structure; a second semiconductor chip having a lower portion surrounded by the first redistribution structure; a first encapsulant disposed on the upper surface of the first redistribution structure to encapsulate the first semiconductor chip; a second encapsulant encapsulating the second semiconductor chip and having a lower portion surrounded by the first redistribution structure; and a conductive support layer supporting the second semiconductor chip and the second encapsulant on an upper surface of the second semiconductor chip.
