Samsung electronics co., ltd. (20240297150). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
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Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240297150 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a base chip, a first semiconductor chip with through-vias and bump structures, and multiple stacked second semiconductor chips with through-vias and adhesive layers.
- The first semiconductor chip has through-vias and bump structures on its front surface.
- The second semiconductor chips are stacked on the first semiconductor chip and have through-vias and adhesive layers on their front surfaces.
- An encapsulant is present between the base chip and the first semiconductor chip, covering both chips and the stacked second semiconductor chips.
- The adhesive layers on the second semiconductor chips have a width equal to or less than the width of the chips in a parallel direction to the upper surface of the base chip.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of integrated circuits in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - Enhances the structural integrity and electrical connectivity of stacked semiconductor chips. - Provides a more efficient and reliable method for packaging multiple semiconductor chips in a compact space.
Benefits: - Increased performance and reliability of electronic devices. - Cost-effective manufacturing process for semiconductor packages. - Improved thermal management and signal integrity.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, leading to improved functionality and durability. The market implications include increased demand for advanced semiconductor packages in various industries such as consumer electronics, automotive, and telecommunications.
Questions about Semiconductor Packaging Technology: 1. How does this technology impact the overall efficiency of electronic devices? 2. What are the key factors influencing the adoption of advanced semiconductor packaging solutions in the market?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices. Regularly check for new developments in materials, design techniques, and manufacturing processes to stay ahead in the industry.
Original Abstract Submitted
a semiconductor package includes a base chip, a first semiconductor chip on the base chip, the first semiconductor chip including first through-vias, first bump structures on the first front surface of the first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, the plurality of second semiconductor chips including second through-vias, adhesive layers respectively on the second front surfaces of the plurality of second semiconductor chips, and an encapsulant between the base chip and the first semiconductor chip, the encapsulant covering at least a portion of each of the first semiconductor chip and the plurality of second semiconductor chips. the adhesive layers respectively have a width equal to or less than a width of the first semiconductor chip and a width of each of the plurality of second semiconductor chips in a direction, parallel to the upper surface of the base chip.
