Samsung electronics co., ltd. (20240274588). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seung-kwan Ryu of Seongnam-si (KR)
Yun-seok Choi of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240274588 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a base package substrate, a first semiconductor chip, and a second semiconductor chip. The base package substrate includes a redistribution region with a redistribution layer, vertical conductive vias, and a recess region. An interposer is located in the recess region, featuring upper pads and through electrodes connected to the upper pads.
Key Features and Innovation:
- Base package substrate with redistribution region and interposer for enhanced connectivity.
- Vertical conductive vias for efficient signal transmission.
- First and second semiconductor chips with conductive interconnection terminals.
- Horizontal placement of semiconductor chips on the interposer for optimized layout.
- Overlapping arrangement of the interposer with the semiconductor chips for compact design.
Potential Applications: This technology can be applied in various semiconductor packaging solutions, especially in high-performance computing, telecommunications, and consumer electronics.
Problems Solved:
- Improved signal transmission and connectivity within the semiconductor package.
- Enhanced layout efficiency and space utilization.
- Facilitates the integration of multiple semiconductor chips in a compact form factor.
Benefits:
- Higher performance and reliability in semiconductor devices.
- Compact design for space-constrained applications.
- Enhanced signal integrity and reduced signal loss.
Commercial Applications: This technology can be utilized in the development of advanced microprocessors, memory modules, and system-on-chip (SoC) solutions for a wide range of electronic devices.
Prior Art: Readers interested in exploring prior art related to this technology can refer to patents and research papers in the field of semiconductor packaging, interposer technology, and signal transmission in integrated circuits.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging, interposer design, and signal integrity analysis to further enhance the performance and efficiency of this technology.
Questions about Semiconductor Package Technology: 1. How does the interposer contribute to the overall performance of the semiconductor package? The interposer plays a crucial role in providing a platform for efficient signal transmission between the semiconductor chips and the base package substrate, ensuring optimal connectivity and layout efficiency.
2. What are the potential challenges in implementing this semiconductor packaging technology in mass production? Mass production of semiconductor packages incorporating advanced features like vertical conductive vias and interposers may face challenges related to cost-effectiveness, manufacturing scalability, and quality control processes.
Original Abstract Submitted
a semiconductor package includes a base package substrate, a first semiconductor chip, and a second semiconductor chip. the base package substrate includes a redistribution region where a redistribution layer is provided, a plurality of vertical conductive vias connected to the redistribution layer, and a recess region recessed from an upper surface of the redistribution region. the base package substrate further includes an interposer in the recess region, the interposer comprising a substrate, a plurality of upper pads disposed at an upper surface of the substrate, and plurality of through electrodes respectively connected to the plurality of upper pads to pass through the substrate. the first semiconductor chip and second semiconductor chip, each include a plurality of conductive interconnection terminals respectively connected to the plurality of upper pads and the vertical conductive vias exposed at the upper surface of the redistribution region. the first semiconductor chip and the second semiconductor chip are mounted on the extension region and the interposer and disposed horizontally apart from each other. as seen from a plan view, the interposer is disposed to overlap a portion of each of the first semiconductor chip and the second semiconductor chip.
