Samsung electronics co., ltd. (20240274582). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240274582 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of multiple semiconductor chips stacked one on top of the other. Each chip has a substrate with a front and back surface, along with first and second back conductive pads and a redistribution pattern on the back surface.
- The semiconductor package includes multiple semiconductor chips stacked sequentially.
- Each semiconductor chip has a substrate with front and back surfaces.
- The back surface of each chip contains first and second back conductive pads.
- A redistribution pattern is also present on the back surface, situated between the second back conductive pads.
Potential Applications: - This technology could be used in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers. - It may find applications in the automotive industry for advanced driver assistance systems (ADAS) and in-vehicle infotainment systems.
Problems Solved: - This innovation allows for more efficient stacking of semiconductor chips, leading to increased performance and functionality in electronic devices. - The redistribution pattern helps in optimizing the flow of electrical signals within the semiconductor package.
Benefits: - Improved performance and functionality in electronic devices. - Enhanced signal flow and connectivity within the semiconductor package.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Electronic Devices This technology can be utilized in the production of high-performance electronic devices, catering to a wide range of industries including consumer electronics, automotive, and telecommunications.
Questions about Semiconductor Packaging Technology: 1. How does the redistribution pattern on the back surface of the semiconductor chips contribute to the overall performance of the package? - The redistribution pattern helps in optimizing the flow of electrical signals between the semiconductor chips, enhancing connectivity and efficiency.
2. What are the potential challenges in implementing this advanced semiconductor packaging technology in mass production? - Some challenges may include ensuring precise alignment of the stacked chips and maintaining consistent quality control throughout the manufacturing process.
Original Abstract Submitted
a semiconductor package includes a plurality of semiconductor chips stacked sequentially. each semiconductor chip includes a substrate including a back surface and a front surface which are opposite to each other, a plurality of first back conductive pads disposed on the back surface, a plurality of second back conductive pads disposed on the back surface, and a redistribution pattern disposed on the back surface and disposed between the plurality of second back conductive pads.
