Samsung electronics co., ltd. (20240274579). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240274579 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a chip structure with a first stack semiconductor chip, including a first sub-chip and a second sub-chip of a different type bonded to the first sub-chip.
- The first molding layer molds the second sub-chip on the first sub-chip.
- A first redistribution structure is positioned above the first stack semiconductor chip and the first molding layer.
- A second redistribution structure is located under the chip structure and bonded to it.
- A bonding wire connects the second redistribution structure to the first redistribution structure.
- A second molding layer seals the chip structure and the bonding wire on the second redistribution structure.
Potential Applications: - This technology can be used in various electronic devices requiring compact and efficient semiconductor packaging. - It can be applied in mobile phones, tablets, laptops, and other consumer electronics.
Problems Solved: - Addresses the need for compact and reliable semiconductor packaging solutions. - Enhances the performance and durability of electronic devices.
Benefits: - Improved efficiency and performance of electronic devices. - Enhanced reliability and durability of semiconductor packages. - Cost-effective manufacturing process for semiconductor packaging.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the consumer electronics industry to improve the performance and reliability of electronic devices. It can also benefit manufacturers by providing a cost-effective and efficient semiconductor packaging solution.
Questions about Semiconductor Packaging Technology: 1. How does this advanced semiconductor packaging technology improve the performance of electronic devices? This technology enhances the efficiency and reliability of electronic devices by providing a compact and reliable semiconductor packaging solution.
2. What are the potential commercial applications of this semiconductor packaging technology? This technology can be applied in various consumer electronics, such as mobile phones, tablets, and laptops, to enhance their performance and durability.
Original Abstract Submitted
a semiconductor package includes a chip structure including a first stack semiconductor chip, which includes a first sub-chip and a second sub-chip that is bonded to the first sub-chip and is of a different type from the first sub-chip, a first molding layer configured to mold the second sub-chip on the first sub-chip, and a first redistribution structure arranged above the first stack semiconductor chip and the first molding layer, a second redistribution structure arranged under the chip structure and bonded to the chip structure, a bonding wire electrically connecting the second redistribution structure to the first redistribution structure, and a second molding layer configured to seal, on the second redistribution structure, the chip structure and the bonding wire.
