Samsung electronics co., ltd. (20240274499). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240274499 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a stiffener that surrounds a semiconductor chip on a circuit board. The stiffener is made up of a first metal layer, a core layer, and a second metal layer stacked sequentially.
- The semiconductor package includes a stiffener with a unique composition of metal layers.
- The stiffener provides structural support and protection for the semiconductor chip on the circuit board.
- The sequential stacking of metal layers in the stiffener enhances the overall durability and reliability of the semiconductor package.
- This innovation aims to improve the performance and longevity of semiconductor devices in various applications.
- The design of the stiffener offers a practical solution to enhance the overall quality of semiconductor packaging.
Potential Applications: - This technology can be applied in the manufacturing of electronic devices such as smartphones, computers, and automotive systems. - It can also be used in industrial applications where robust semiconductor packaging is required.
Problems Solved: - Addresses the need for improved structural support and protection for semiconductor chips. - Enhances the durability and reliability of semiconductor packages in various applications.
Benefits: - Improved performance and longevity of semiconductor devices. - Enhanced structural integrity and protection for semiconductor chips. - Increased reliability and quality of electronic products.
Commercial Applications: Title: Enhanced Semiconductor Packaging Technology for Improved Device Performance This technology can be utilized in the consumer electronics industry, automotive sector, and industrial applications to enhance the reliability and durability of semiconductor devices.
Questions about Semiconductor Packaging Technology: 1. How does the composition of the stiffener in the semiconductor package impact the overall performance of the device? - The composition of the stiffener plays a crucial role in providing structural support and protection for the semiconductor chip, ultimately enhancing the device's performance and longevity.
2. What are the potential cost implications of implementing this innovative semiconductor packaging technology? - While the initial cost of implementing this technology may be higher, the long-term benefits in terms of improved device performance and reliability outweigh the initial investment.
Original Abstract Submitted
provided is a semiconductor package including a stiffener. the semiconductor package comprises a circuit board, a semiconductor chip on the circuit board, and a stiffener around the semiconductor chip, wherein the stiffener includes a first metal layer, a core layer, and a second metal layer sequentially stacked.
