Samsung electronics co., ltd. (20240266308). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Hyungeun Choi of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266308 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of multiple layers and components, including substrates, dielectric structures, transistors, bonding pads, and memory cell structures.
- The device features a lower substrate with a lower dielectric structure, where a transistor is located.
- A lower bonding pad is situated within the lower dielectric structure, along with an upper dielectric structure on top.
- An upper substrate rests on the upper dielectric structure, housing a memory cell structure.
- An upper bonding pad is present in the upper dielectric structure, with the lower and upper bonding pads overlapping the memory cell structure.
Potential Applications: - This semiconductor device could be used in various electronic devices such as smartphones, tablets, and computers. - It may find applications in the automotive industry for advanced driver assistance systems (ADAS) and autonomous vehicles. - The technology could also be utilized in medical devices, industrial equipment, and communication systems.
Problems Solved: - The device provides a compact and efficient solution for integrating multiple components in a semiconductor structure. - It offers improved performance and reliability in electronic devices. - The overlapping bonding pads help in enhancing connectivity and signal transmission within the device.
Benefits: - Enhanced functionality and performance in electronic devices. - Compact design leading to space-saving in device manufacturing. - Improved connectivity and signal transmission efficiency.
Commercial Applications: Title: Advanced Semiconductor Device for Enhanced Electronic Systems This technology has significant commercial potential in the consumer electronics market, automotive industry, healthcare sector, and telecommunications industry. The compact design and improved performance of the semiconductor device make it a valuable component for various electronic systems.
Questions about the Technology: 1. How does the overlapping bonding pad design contribute to the efficiency of the semiconductor device? 2. What are the specific advantages of integrating memory cell structures in the upper substrate of the device?
Original Abstract Submitted
a semiconductor device includes a lower substrate, a lower dielectric structure on the lower substrate, a transistor between the lower substrate and the lower dielectric structure, a lower bonding pad in the lower dielectric structure, an upper dielectric structure on the lower dielectric structure, an upper substrate on the upper dielectric structure, a memory cell structure between the upper substrate and the upper dielectric structure, and an upper bonding pad in the upper dielectric structure. a top surface of the lower bonding pad is in contact with a bottom surface of the upper bonding pad. the lower bonding pad and the upper bonding pad overlap the memory cell structure.
